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Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.Advantages & Application Notes:Processing info: It can be applied by many dispensing, stamping and screen printing techniques.Dispensing: compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a single-component fashion. Screen Printing: best using >200 metal mesh, with polymer squeegee blade with 80D hardness.Stamping: small dots 6 mil in diameter can be realized. Misc / Other notes: Many technical papers written over 30-40 year lifetime. Over 1 trillion chips attached at a single company: no failures, Six Sigma and Certified Parts Supplier award winner.Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor coil.Many custom modified products available, for the following improvements: viscosity and appearance, flexibility and thermal conductivity. Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 2.03 g/cc
2.03 g/cc
Part A
3.07 g/cc
3.07 g/cc
Part B
Particle Size <= 45 µm
<= 45 µm
Viscosity 220 - 3200 cP

@Temperature 23.0 °C
220 - 3200 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 75
75
Tensile Modulus 5.576 GPa
808.7 ksi
Storage
Shear Strength 10.17 MPa
1475 psi
Lap
>= 11.7 MPa
>= 1700 psi
Die
Thermal Properties Metric English Comments
CTE, linear 31.0 µm/m-°C
17.2 µin/in-°F
Below Tg
158 µm/m-°C
87.8 µin/in-°F
Above Tg
Thermal Conductivity 2.50 W/m-K
17.4 BTU-in/hr-ft²-°F
Based on standard method: Laser Flash
29.0 W/m-K
201 BTU-in/hr-ft²-°F
Based on Thermal Resistance Data: R = L x K<sup>-1</sup>x A<sup>-1</sup>
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 425 °C
797 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00040 ohm-cm
<= 0.00040 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 2.0 ppm
2.0 ppm
Ionic Impurities - K (Potassium) 3.0 ppm
3.0 ppm
Ionic Impurities - Cl (Chloride) 73 ppm
73 ppm
Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
15.0 min

@Temperature 120 °C
0.250 hour

@Temperature 248 °F
45.0 min

@Temperature 175 °C
0.750 hour

@Temperature 347 °F
Pot Life 3600 min
3600 min
Shelf Life 12.0 Month

@Temperature 23.0 °C
12.0 Month

@Temperature 73.4 °F
12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Color Silver
Part A
Silver
Part B
Consistency Smooth thixotropic paste
Ionic Impurities NH4 98 ppm
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 4.63
Weight Loss 0.59%
200°C
1.09%
250°C
1.67%
300°C
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