Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | >= 260 W/m-K | >= 1800 BTU-in/hr-ft²-°F | In Plane; ASTM 1461-01 |
Plansee Cu-MoCu-Cu Laminate A high performance, three-layer composite.Characteristics:High thermal conductivityLow thermal expansionIdeal for heat dissipation applications related to: IGBT modules, RF packages, and LED chips, .. |
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Thermal Conductivity | 260 W/m-K | 1800 BTU-in/hr-ft²-°F | |
CMW® ELKONITE® 1060 Silver Tungsten Carbide Contact Material Electrical contactor material for medium current ac applicationsInformation provided by CMW Inc. |