Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.940 - 0.940 W/m-K @Temperature 100 - 100 °C |
6.52 - 6.52 BTU-in/hr-ft²-°F @Temperature 212 - 212 °F |
Average value: 0.940 W/m-K Grade Count:1 |
Overview of materials for Phenolic; Unreinforced; Molded This property data is a summary of similar materials in the MatWeb database for the category "Phenolic; Unreinforced; Molded". Each property range of values reported is minimum and maximum values of.. |
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Thermal Conductivity | 0.940 W/m-K | 6.52 BTU-in/hr-ft²-°F | |
Schott N-BASF2 Glass Information Provided by SCHOTT North America, Inc. |
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Thermal Conductivity | 0.940 W/m-K @Temperature 100 °C |
6.52 BTU-in/hr-ft²-°F @Temperature 212 °F |
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Plenco 6553 Phenolic, Granular, Compression Molded Two-Stage Phenolic. PLENCO 06553 is a phenolic molding compound, formulated specifically for automotive brake pistons. 06553 exhibits excellent dimensional stability, and resistance to brake fluids.. |
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Thermal Conductivity | 0.940 W/m-K | 6.52 BTU-in/hr-ft²-°F | |
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, .. |
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Thermal Conductivity | 0.940 W/m-K | 6.52 BTU-in/hr-ft²-°F | ASTM C-518 |
Sumitomo Bakelite North America RX® 655 Novolac Phenolic Fiberglass and mineral reinforced phenolic molding compound with very high fill level (75%). Excellent dimensional stability and good strength at elevated temperatures. Very low thermal expansion .. |