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Polymer Property : Thermal Conductivity = 6.52 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 0.940 - 0.940 W/m-K

@Temperature 100 - 100 °C
6.52 - 6.52 BTU-in/hr-ft²-°F

@Temperature 212 - 212 °F
Average value: 0.940 W/m-K Grade Count:1
Overview of materials for Phenolic; Unreinforced; Molded
This property data is a summary of similar materials in the MatWeb database for the category "Phenolic; Unreinforced; Molded". Each property range of values reported is minimum and maximum values of..
Thermal Conductivity 0.940 W/m-K
6.52 BTU-in/hr-ft²-°F
Schott N-BASF2 Glass
Information Provided by SCHOTT North America, Inc.
Thermal Conductivity 0.940 W/m-K

@Temperature 100 °C
6.52 BTU-in/hr-ft²-°F

@Temperature 212 °F
Plenco 6553 Phenolic, Granular, Compression Molded
Two-Stage Phenolic. PLENCO 06553 is a phenolic molding compound, formulated specifically for automotive brake pistons. 06553 exhibits excellent dimensional stability, and resistance to brake fluids..
Thermal Conductivity 0.940 W/m-K
6.52 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..
Thermal Conductivity 0.940 W/m-K
6.52 BTU-in/hr-ft²-°F
ASTM C-518
Sumitomo Bakelite North America RX® 655 Novolac Phenolic
Fiberglass and mineral reinforced phenolic molding compound with very high fill level (75%). Excellent dimensional stability and good strength at elevated temperatures. Very low thermal expansion ..
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