Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 1.15 - 1.30 W/m-K | 8.00 - 9.00 BTU-in/hr-ft²-°F | |
Master Bond EP76M-F Electrically Conductive, Two Part Epoxy Description: Master Bond EP76M-F is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing, and coating formulated to cure at room temperature or .. |
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Thermal Conductivity | 1.15 - 1.30 W/m-K | 8.00 - 9.00 BTU-in/hr-ft²-°F | |
Master Bond MasterSil 156 Two Part, Low Viscosity Silicone Description: Master Bond MasterSil 156 is a two component, lower viscosity silicone system for high performance potting, encapsulation and sealing. MasterSil 156 combines high temperature resistance.. |
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Thermal Conductivity | 1.15 W/m-K | 8.00 BTU-in/hr-ft²-°F | |
Cotronics Resbond™ 918 High Temperature Ceramic Adhesive, One Composition |
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Thermal Conductivity | 1.15 W/m-K | 8.00 BTU-in/hr-ft²-°F | |
Cotronics Resbond™ 940 High Temperature Ceramic Adhesive, Fast Set |
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Thermal Conductivity | 1.15 W/m-K | 8.00 BTU-in/hr-ft²-°F | |
Cotronics 4420 One-Part Epoxy |