Polymer Property : Cure Time = 0.0833 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
NextGen Adhesives P907-13 Fiber Optic Adhesive Description: NGAC P907-13 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc..
Cure Time	5.00 - 10.0 min @Temperature 150 °C	0.0833 - 0.167 hour @Temperature 302 °F
Resinlab® EP1320 Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the..
Cure Time	5.00 - 10.0 min @Temperature 150 °C	0.0833 - 0.167 hour @Temperature 302 °F
Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where ..
Cure Time	5.00 min @Temperature 150 Â°C	0.0833 hour @Temperature 302 Â°F
Lord Adhesives Metech 6103 Silver Conductor This material is a low viscosity thermoplastic printing ink designed for general purpose application onto various rigid substrate compositions such as epoxy board or other rigid plastic. It is desig..
Cure Time	5.00 min @Temperature 150 Â°C	0.0833 hour @Temperature 302 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2002-50A/B Elastomer Information Provided by Shin-Etsu Silicones of America, Inc.
Cure Time	5.00 min @Temperature 100 °C	0.0833 hour @Temperature 212 °F
Tra-Con Tra-Bond F123MV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123 MV is a fast cure, medium viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminati..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
Tra-Con Tra-Bond F253M Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253M is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status. The unmixed components are light yellow; the mix..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunicatio..
Cure Time	5.00 min @Temperature 85.0 °C	0.0833 hour @Temperature 185 °F
Loctite® 3171 Deep Potting Polyurethane PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.For e..
Cure Time	5.00 min @Temperature 85.0 °C	0.0833 hour @Temperature 185 °F
Loctite® 3180 Deep Potting Polyurethane PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies. For ..
Cure Time	5.00 min @Temperature 120 °C	0.0833 hour @Temperature 248 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditi..
Cure Time	5.00 min @Temperature 100 °C	0.0833 hour @Temperature 212 °F
Atom Adhesives AA-BOND F123 Epoxy Adhesive AA-BOND F123 is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi..
Cure Time	5.00 min @Temperature 204 °C	0.0833 hour @Temperature 399 °F
3M Scotchcast™ 265 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 265 is a new solution to an old problem. Historically, manufactures of coils, stators and armatures have used liquid-based varnishes or resins to coat and impregnate t..
Cure Time	5.00 min @Temperature 482 °C	0.0833 hour @Temperature 900 °F	Step 2
Aremco Ceramacoat™ 845-GDK High Temperature Ceramic-Inorganic Coating Single part, waterborne, silicon-filled, phosphate-bonded, dark green coating for glass and quartz to 2000 ºF (1093 ºC). Primarily used for marking ceramic parts and coating automotive headlamps, ..
Cure Time	5.00 - 10.000 min @Temperature 149 °C	0.0833 - 0.16667 hour @Temperature 300 °F
Master Bond Supreme 3ANHT Epoxy Adhesives for Bonding Stainless Steel Description: Master Bond Polymer System Supreme 3ANHT is a one component, heat cured epoxy adhesive and sealant, featuring high peel and shear strength along with good thermal conductivity and conve..