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Polymer Property : Cure Time = 2880 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
Complete Cure Cycle |
| Northstar Polymers MPP-R02C Semi-rigid Polyurethane Foam Formulation MPP-R02C is semi-rigid foam formulations for molded foam products. It is closed-cell light foam with some structural integrity. Unlike rigid polyurethane foams, the physical properties of a cured pr.. |
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| Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
Complete Cure Cycle |
| Northstar Polymers MPP-W43C Polyurethane Gel MPP-W43C is a polyurethane gel formulation specifically designed for padding and cushioning applications that require Shore Durometer OOO scale hardness materials. With this material, a user can ob.. |
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| Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
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| Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U.. |
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| Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
Complete Cure Cycle |
| Northstar Polymers MAP-R06C Semi Rigid Structural Foam Formulation MPP-R06C is a polyurethane foam formulation. It is closed-cell foam with a good structural integrity and an enhanced skin quality. Unlike polyurethane rigid foams, the physical properties of a cured.. |
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| Cure Time | 2160 - 2880 min @Temperature 25.0 °C |
36.0 - 48.0 hour @Temperature 77.0 °F |
Permit Normal Usage |
| Lord Adhesives Aeroglaze® Z307 Absorptive Conductive Polyurethane Aeroglaze® Z307 black absorptive conductive polyurethane coating is primarily for application to substrates used on spacecraft. These applications include those where coatings must exhibit low ou.. |
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| Cure Time | 1440 - 2880 min @Temperature 22.2 °C |
24.0 - 48.0 hour @Temperature 72.0 °F |
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| Master Bond EP21ARHTND Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHTND is a two component epoxy resin system for high performance bonding, sealing and coating. It has a convenient 100 to 50 mix ratio by weight and is formulat.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
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| Master Bond EP21HT High Temperature Resistant Two Component Epoxy Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating with high temperature resistance up to 400°F. EP21HT produces high strength, durabl.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP21TDCSMed Two Component, Silver Conductive USP Class VI Epoxy Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. The high strength.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP30HT-LO NASA Low Outgassing, Optically Clear Coating Description: Master Bond EP30HT-LO is a moderate viscosity, two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a four to one mix ratio.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP30HV Optically Clear, High Strength Two Part Epoxy Description: Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. It is formulated to cure at room temperature or more rapi.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP30P Epoxy Bonds Glass, Polycarbonates and Acrylics Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is for.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP38CL Adhesive Features Toughness and Durability Description: Master Bond EP38CL is a lower viscosity, optically clear two component epoxy system for high performance bonding, coating, sealing and small encapsulations, featuring toughness and dura.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP41S-1HT Solvent Resistant Adhesive, Sealant and Coating Description: Master Bond EP41S-1HT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a 100 to 30 mix ratio by weight and is formulated to.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
|
| Master Bond EP75-1 Graphite Filled Electrically Conductive Epoxy System Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more .. |
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| Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
|
| Master Bond EP76M Nickel Filled Electrically Conductive Epoxy System Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP79FL Two Component Silver Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP79FL is a two component, silver-coated nickel, electrically conductive system for high performance bonding and sealing. Its most salient features are its high flexibilit.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond MasterSil 151Med Medical Grade Silicone Potting Compound Description: Master Bond MasterSil 151Med is a two component, low viscosity silicone compound for high performance potting and encapsulation. MasterSil 151Med is an addition cured system and does no.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP21CLV Two Component Epoxy System Product Description: Master Bond EP21CLV is a two component, lower viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It features easy handling a.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at .. |
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| Cure Time | 1440 - 2880 min @Temperature 23.9 °C |
24.0 - 48.0 hour @Temperature 75.0 °F |
|
| Master Bond EP30QF Quartz Filled, Two Component Epoxy System Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
|
| Master Bond EP34 Room Temperature Curing Two Component Epoxy System Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. Adhesion to metals, glass, ceramics, woo.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
|
| Master Bond EP35 High Temperature Resistant Two Component Epoxy System Master Bond Polymer Adhesive EP35 is a unique, room temperature curing, two component epoxy adhesive for high temperature bonding applications. Master Bond Polymer Adhesive EP35 produces high stren.. |
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| Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
|
| Cytec (Conap) FR-1271 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
|
| Cytec (Conap) FR-1274 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
|
| Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
at RT, Alternate Cure |
| Aremco Aremco-Bond™ 631 High Performance Epoxide Clear-Amber, 1:1, Good Bond Strength and Corrosion Resistance.Also available filled with aluminum oxide (Alumina) or pigments. |
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| Cure Time | 1440 - 2880 min @Temperature 93.3 °C |
24.0 - 48.0 hour @Temperature 200 °F |
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| Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weig.. |
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