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Polymer Property : Dielectric Strength = 14.9 kV/mm Product List

Electrical Properties

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Electrical Properties Metric English Comments
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® 104R PC
UL rated HB. 200 series recommended when V-2 rating required. 7.0 MFR, for thicker sections without sinks. Internal mold release. FDA food contact compliant in limited colors.Effective January 15..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® 124 PC
UL rated HB as of 10/97. 200 series recommended when V-2 rating required. 17.5 MFR, for small, intricate parts. FDA food contact compliant in limited colors.Effective January 15th, 2007 this grade..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® 124R PC
UL rated HB. 200 series recommended when V-2 rating required. 17.5 MFR, for small, intricate parts. FDA food contact compliant in limited colors. Effective January 15th, 2007 this grade will no l..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HF1140R PC
High flow grade. Heat stabilized. Enhanced level of mold release. FDA food contact compliant in limited colors. Effective January 15th, 2007 this grade will no longer be supported with biocompatib..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP1R PC (Asia Pacific)
High flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO sterilizable. Contains a higher amount..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP2 PC
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains m..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP2NR PC (Europe-Africa-Middle East)
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains no..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP2R PC
Med/High flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains a..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP4R PC
Medium flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). ETO and steam sterilizable. Contains a h..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP4R PC (Asia Pacific)
Medium flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains a hig..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HPS1 PC
High flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, e-beam and gamma sterilizable. Contains..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HPS1R PC
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, e-beam and gamma sterilizable. Cont..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HPS1R PC (Asia Pacific)
High flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, e-beam and gamma sterilizable. Contains..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HPS1S PC
High flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, e-beam and gamma sterilizable. Contains..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HPS2 PC
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, steam, e-beam and gamma sterilizable..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HPS2 PC (Asia Pacific)
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, steam, e-beam and gamma sterilizable..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HPS2R PC
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, steam, e-beam and gamma sterilizable..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D 149
SABIC Innovative Plastics Lexan® HPS2S PC
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, steam, e-beam, and gamma steriliza..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HPS2S PC (Asia Pacific)
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, steam, e-beam, and gamma steriliza..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HPS2S PC (Europe-Africa-Middle East)
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, steam, e-beam, and gamma steriliza..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D 149
SABIC Innovative Plastics Lexan® ML7678 PC
17.5 MFR, for small, intricate parts. FDA food contact compliant in limited colors. Enhanced mold release package.This data was supplied by SABIC-IP for the Americas region.
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® 144R PC
UL rated HB. 200 series recommended when V-2 rating required. MFR 10.5. Internal mold release. FDA food contact compliant in limited colors.Effective January 15th, 2007 this grade will no longer ..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP1 PC
High flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO sterilizable. Contains mold release.
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP1R PC
High flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO sterilizable. Contains a higher amount..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP2 PC (Asia Pacific)
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains m..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP2NR PC
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains no..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP2NR PC (Asia Pacific)
Med/high flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains no..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP4 PC
Medium flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains mol..
Dielectric Strength 14.9 kV/mm

@Thickness 3.20 mm
378 kV/in

@Thickness 0.126 in
in air; ASTM D149
SABIC Innovative Plastics Lexan® HP6 PC
Low/med flow polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO and steam sterilizable. Contains mo..
Dielectric Strength 14.9 kV/mm

@Frequency 60.0 Hz
378 kV/in

@Frequency 60.0 Hz
short time, wet; ASTM D149
Sumitomo Bakelite North America Epiall® 1960B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy
Epiall 1960B-1 is a mineral and short fiberglass filled epoxy compound, formulated for the encapsulation of passive electronic devices.Information provided by Sumitomo Bakelite North America, Inc.
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