Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Sumitomo Bakelite North America Epiall® 1960B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Encapsulating, Glass or Mineral Filled , Filled/Reinforced Thermoset
Manufacturer Sumitomo Bakelite North America
Trade Name Epiall®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Sumitomo Bakelite North America Epiall® 1960B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Epiall 1960B-1 is a mineral and short fiberglass filled epoxy compound, formulated for the encapsulation of passive electronic devices.Information provided by Sumitomo Bak North America, Inc.
Physical Properties Metric English Comments
Density 1.76 g/cc
0.0636 lb/in³
ASTM D792
Water Absorption 0.20 %

@Temperature 50.0 °C,
Time 173000 sec
0.20 %

@Temperature 122 °F,
Time 48.0 hour
ASTM D570
Linear Mold Shrinkage 0.0030 - 0.0050 cm/cm
0.0030 - 0.0050 in/in
ASTM D955
Mechanical Properties Metric English Comments
Tensile Strength at Break 80.0 MPa
11600 psi
ASTM D638
Flexural Strength 115 MPa
16700 psi
at rupture; ASTM D790
Flexural Modulus 12.4 GPa
1800 ksi
ASTM D790
Compressive Strength 242 MPa
35100 psi
ASTM D695
Izod Impact, Notched 0.370 J/cm
0.693 ft-lb/in
ASTM D256
Thermal Properties Metric English Comments
Deflection Temperature at 1.8 MPa (264 psi) 275 °C
527 °F
Post Baked; ASTM D648A
Electrical Properties Metric English Comments
Dielectric Constant 4.0

@Frequency 1.00e+6 Hz
4.0

@Frequency 1.00e+6 Hz
wet; ASTM D150
Dielectric Strength 12.9 kV/mm

@Frequency 60.0 Hz
328 kV/in

@Frequency 60.0 Hz
step-by-step, wet; ASTM D149
14.9 kV/mm

@Frequency 60.0 Hz
378 kV/in

@Frequency 60.0 Hz
short time, wet; ASTM D149
Dissipation Factor 0.019

@Frequency 1.00e+6 Hz
0.019

@Frequency 1.00e+6 Hz
wet; ASTM D150
Arc Resistance 180 sec
180 sec
ASTM D495
Descriptive Properties Value Comments
Color Black
Form Granular
Molding Method Compression
Transfer
Copyright © lookpolymers.com All Rights Reserved