Electrical Properties | Metric | English | Comments |
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Volume Resistivity | 5.30e+15 ohm-cm @Temperature 25.0 °C |
5.30e+15 ohm-cm @Temperature 77.0 °F |
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Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi.. |
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Volume Resistivity | 5.30e+15 ohm-cm | 5.30e+15 ohm-cm | Cured property; ASTM D257 |
Aptek 2100-A7C/B Low modulus urethane staking compound APTEK 2100-A7C/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Althoug.. |