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Polymer Property : Volume Resistivity = 5.30e+15 ohm-cm Product List

Electrical Properties

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Electrical Properties Metric English Comments
Volume Resistivity 5.30e+15 ohm-cm

@Temperature 25.0 °C
5.30e+15 ohm-cm

@Temperature 77.0 °F
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant
LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi..
Volume Resistivity 5.30e+15 ohm-cm
5.30e+15 ohm-cm
Cured property; ASTM D257
Aptek 2100-A7C/B Low modulus urethane staking compound
APTEK 2100-A7C/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Althoug..
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