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Aptek 2100-A7C/B Low modulus urethane staking compound

Category Polymer , Adhesive , Thermoset , Polyurethane, TS , Thermoset Polyurethane, Adhesive
Manufacturer Aptek Laboratories
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 2100-A7C/B Low modulus urethane staking compound.pdf
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Material Notes:
APTEK 2100-A7C/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Although APTEK 2100-A7C/B is capable of achieving full cure at room temperature, a short term exposure to moderate heat will greatly reduce processing time and optimize cured properties.100% solids, solvent free system that will not form voids during cure or service life; Low Tg for excellent low-temperature cycling and performance; Very good substrate adhesion, superior to silicones; Exceeds NASA outgassing requirements for high vacuum environmentsAPTEK 2100-A7C is a translucent, filled polyol resin. APTEK 2100-B is a yellow/orange, organic isocyanate.Information provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 0.990 g/cc
0.0358 lb/in³
A Component; ASTM D1475
1.21 g/cc
0.0437 lb/in³
B Component; ASTM D1475
Viscosity 35 cP
35 cP
B Component; ASTM D1824
Outgassing - Total Mass Loss 0.38 %
0.38 %
Cured property; at 10E-6 torr; ASTM E-595
Collected Volatile Condensable Material 0.030 %
0.030 %
Cured property; at 10E-6 torr; ASTM E595
Mechanical Properties Metric English Comments
Hardness, Shore A 55
55
Cured property; ASTM D2240
Tensile Strength, Ultimate 2.76 MPa
400 psi
Cured property; ASTM D412
Elongation at Break 265 %
265 %
Cured property; ASTM D412
Thermal Properties Metric English Comments
CTE, linear 79.0 µm/m-°C

@Temperature 20.0 °C
43.9 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 1; JMTP P200
185 µm/m-°C

@Temperature 20.0 °C
103 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 2; JMTP P200
Glass Transition Temp, Tg -70.0 °C
-94.0 °F
Cured property; JMTP 200
Flash Point >= 150 °C
>= 302 °F
A Component; ASTM D92
>= 150 °C
>= 302 °F
B Component; ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity 5.30e+15 ohm-cm
5.30e+15 ohm-cm
Cured property; ASTM D257
Dielectric Constant 3.5

@Frequency 1000 Hz
3.5

@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength >= 14.2 kV/mm
>= 360 kV/in
Cured property; 0.1 inch; ASTM D149
Dissipation Factor 0.030

@Frequency 1000 Hz
0.030

@Frequency 1000 Hz
Cured property; ASTM D150
Processing Properties Metric English Comments
Processing Temperature 80.0 °C
176 °F
Cure 5 hrs + 2 hrs at RT
100 °C
212 °F
Cure 3 hrs + 2 hrs at RT
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