Songhan Plastic Technology Co.,Ltd.

Hexcel® Redux® 335U Adhesive film for bonding metallic and composite components (0.03 psf)

Category Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Hexcel
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® Redux® 335U Adhesive film for bonding metallic and composite components (0.03 psf).pdf
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Material Notes:
Redux 335 is a film adhesive curing at 250F. It is available in a range of standard areal weights from 0.015 to 0.06 psf. It is available either unsupported or with knitted and/or matt carrier for additional glueline thickness control.Features: Cures in 60 min at 250°F for optimum properties; Good lap shear performance at temperatures ranging from -67°F to 210°F; Excellent peel properties from -67°F to 180°F; Excellent properties in sandwich structures from -67°F to 180°F; Good performance with 250°F - curing fibre reinforced composites in either co-cure or secondary bonding pocesses; Good drape at temperatures as low as 50°F; Less than 1% volatile content.Applications: Aluminum to aluminum bonding; Fiber-reinforced composite to composite bonding; Aluminum honeycomb sandwich bonding; Aramid honeycomb sandwich bonding.
Mechanical Properties Metric English Comments
Shear Strength 17.2 MPa

@Temperature 93.3 °C
2500 psi

@Temperature 200 °F
Lap Shear
29.6 MPa

@Temperature 60.0 °C
4300 psi

@Temperature 140 °F
Lap Shear
43.4 MPa

@Temperature 21.1 °C
6300 psi

@Temperature 70.0 °F
Lap Shear
Peel Strength 9.12 kN/m

@Temperature 21.1 °C
52.0 pli

@Temperature 70.0 °F
Processing Properties Metric English Comments
Shelf Life 12.0 Month

@Temperature -17.8 °C
12.0 Month

@Temperature 0.000 °F
Descriptive Properties Value Comments
Areal Weight (psf) 0.03
Climbing Drum Peel (in-lb/3in) 80
Standard Roll (ft2) 540
Support None
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