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Loctite® CHIPBONDER® 3619 Low Temperature Cure, Syringe Dispense

Category Polymer , Adhesive , Thermoset
Manufacturer Loctite
Trade Name CHIPBONDER®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Loctite® CHIPBONDER® 3619 Low Temperature Cure, Syringe Dispense.pdf
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  Online Service   lookpolymers   27660005
Material Notes:
Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer.Loctite® syringe dispense products provide good performance for electronics assembly:High Speed DispenseLow Temperature CureProducts for difficult-to-bond substratesLoctite® 3619 CHIPBONDER® Low Temperature Cure, Syringe DispenseA low temperature curing adhesive designed for high-speed syringe dispense.Peaked dot profile. Process Method:High speedSyringe dispensing40,000 DPH capable Storage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)
Processing Properties Metric English Comments
Cure Time 1.50 min

@Temperature 100 °C
0.0250 hour

@Temperature 212 °F
Shelf Life 6.00 Month
6.00 Month
From date of manufacture
Descriptive Properties Value Comments
Color Red
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