Physical Properties | Metric | English | Comments |
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Thickness | 9.00 - 12.0 microns | 0.354 - 0.472 mil | Fired |
Lord Adhesives Metech 3255 Silver Conductor This conductor composition is a silver bearing paste composition designed for screen print application of a solderable electrode base onto various types of electrical ceramic component devices. The .. |
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Thickness | 9.00 - 11.0 microns | 0.354 - 0.433 mil | Fired |
Lord Adhesives Metech 3610 Gold Alloy Conductor Composition Gold alloy conductor composition 3610 is a mixed bond composition designed for microcircuit applications requiring aluminum wire bonds. It offers excellent aged wire bond adhesion for both aluminum .. |
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Thickness | 9.00 - 11.0 microns | 0.354 - 0.433 mil | Fired |
Lord Adhesives Metech 3612 Gold Conductor Composition Gold conductor composition 3612 is a mixed bond conductor designed for use in chip and wire bonding applications and for use in manufacturing multilayer interconnection circuitry. The composition fi.. |
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Thickness | 9.00 microns | 0.354 mil | Fired thickness, printed through 325ss mesh |
Gwent Electronic Materials C2050830D8 80:20 Silver Palladium Ink C2050830D8 is an ink based on a 80:20 ratio of Silver:Palladium. It is designed for use in Single Layer PZT applications. This ink can be used in both dip and hand soldering. This Ink is in a ready .. |
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Thickness | <= 9.00 microns | <= 0.354 mil | |
Eifeler Coatings Technology TiC CVD Coating The titanium carbide coating indicates the following properties: Extremely high hardness; Very good adhesion; Low temperature resistance; Relatively high brittlenessInformation provided by Eifel.. |