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Polymer Property : Thickness = 0.354 mil Product List

Physical Properties

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Physical Properties Metric English Comments
Thickness 9.00 - 12.0 microns
0.354 - 0.472 mil
Fired
Lord Adhesives Metech 3255 Silver Conductor
This conductor composition is a silver bearing paste composition designed for screen print application of a solderable electrode base onto various types of electrical ceramic component devices. The ..
Thickness 9.00 - 11.0 microns
0.354 - 0.433 mil
Fired
Lord Adhesives Metech 3610 Gold Alloy Conductor Composition
Gold alloy conductor composition 3610 is a mixed bond composition designed for microcircuit applications requiring aluminum wire bonds. It offers excellent aged wire bond adhesion for both aluminum ..
Thickness 9.00 - 11.0 microns
0.354 - 0.433 mil
Fired
Lord Adhesives Metech 3612 Gold Conductor Composition
Gold conductor composition 3612 is a mixed bond conductor designed for use in chip and wire bonding applications and for use in manufacturing multilayer interconnection circuitry. The composition fi..
Thickness 9.00 microns
0.354 mil
Fired thickness, printed through 325ss mesh
Gwent Electronic Materials C2050830D8 80:20 Silver Palladium Ink
C2050830D8 is an ink based on a 80:20 ratio of Silver:Palladium. It is designed for use in Single Layer PZT applications. This ink can be used in both dip and hand soldering. This Ink is in a ready ..
Thickness <= 9.00 microns
<= 0.354 mil
Eifeler Coatings Technology TiC CVD Coating
The titanium carbide coating indicates the following properties: Extremely high hardness; Very good adhesion; Low temperature resistance; Relatively high brittlenessInformation provided by Eifel..
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