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Parker Chomerics ParPHorm® 1800 Non-Conductive Form-in-Place Gasket

Category Polymer , Thermoset
Manufacturer Parker Chomerics
Trade Name ParPHorm®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics ParPHorm® 1800 Non-Conductive Form-in-Place Gasket.pdf
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Material Notes:
Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material cost versus performance and can provide low cost alternatives for less demanding applications. Chomerics corrosion resistant materials inherently provide protection against galvanic activity. They may eliminate the need for nickel or tin plating and or secondary environmental gaskets. Chomerics general purpose materials exhibit excellent electrical and mechanical properties on metallic and shield plastic housing. Chomerics silver filled materials provide high shielding and conductivity critical for inter-compartmental shields.Features: Lower deflection forces and a broad deflection range, Corrosion resistant materials can eliminate plating or secondary environmental gasket, Good adhesion to many substrates, Supply chain management providing ongoing logistics, and Low cost and rapid prototyping.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 1.40 g/cc
1.40 g/cc
ASTM D297
Mechanical Properties Metric English Comments
Hardness, Shore A 20
20
ASTM D2240
Tensile Strength >= 1.03 MPa
>= 150 psi
ASTM D412
Elongation at Break 650 %
650 %
ASTM D412
Compression Set 35 %

@Temperature 100 °C,
Time 252000 sec
35 %

@Temperature 212 °F,
Time 70.0 hour
25% deflection; ASTM D395
Processing Properties Metric English Comments
Cure Time 18.0 min

@Temperature 22.0 °C
0.300 hour

@Temperature 71.6 °F
50% RH, Tack Free Time
240 min

@Temperature 22.0 °C
4.00 hour

@Temperature 71.6 °F
50% RH, Handling Time
1440 min

@Temperature 22.0 °C
24.0 hour

@Temperature 71.6 °F
50% RH, Full Cure
Descriptive Properties Value Comments
Color Dark Grey
Resin System Silicone
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