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Reltek BONDiT™ B-536TH Adhesive System

Category Polymer , Adhesive
Manufacturer Reltek LLC
Trade Name BONDiT™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Reltek BONDiT™ B-536TH Adhesive System.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Key PropertiesVery high strength bonding of dissimilar materials. High moisture and solvent resistance. Fast ambient cure with good pot life. Ease of use. ApplicationsOutstanding adhesive for very high strength potting and assembly applications. Bonds most plastics, metals, glass and ceramics. Good for electronics applications. High moisture resistance. Full cure 60 minutes at ambient or 10 minutes at 170º F or higher temperatures for faster cure down to 15 sec.Information provided by Reltek LLC
Physical Properties Metric English Comments
Specific Gravity 1.05 g/cc
1.05 g/cc
A
1.42 g/cc
1.42 g/cc
B
Viscosity 2500 cP
2500 cP
Mechanical Properties Metric English Comments
Tensile Strength at Break 51.15 MPa
7418 psi
Tensile Strength, Yield 53.04 MPa
7693 psi
Elongation at Break 9.2 %
9.2 %
Elongation at Yield 8.6 %
8.6 %
Descriptive Properties Value Comments
Color Clear with slight amber
Peak Stress (psi) 7693
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