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Polymer Property : CTE, linear = 111 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear |
200
µm/m-°C @Temperature 23.0 - 60.0 °C |
111
µin/in-°F @Temperature 73.4 - 140 °F |
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Murtfeldt Material ”S”® 1000 Green Polyethylene
Material ”S”® 1000 is exclusively produced from ultra-high molecular weight polyethylene powder that is mixed with finely milled Original Material ”S”®. The fine milled material is compressio..
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| CTE, linear |
200
µm/m-°C @Temperature 23.0 - 60.0 °C |
111
µin/in-°F @Temperature 73.4 - 140 °F |
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Murtfeldt Original Material ”S”® plus + LF Polyethylene, Low Friction
This material has half the sliding friction coefficient of the Original Material ”S”®. This enables an increased machine running speed at the same time as less abrasion and thus a lower maintenan..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
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Polikim ULPOLEN® 1000 UHMWPE Standard
Standard Ulpolen® 1000 is the universal type primarily preferred on the condition that its technical properties meet operating environment requirements. It is more cost efficient compared to specia..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
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Okulen® 1000 PE-UHMW, AST
OKULEN® 1000 is an ultra high molecular low pressure polyethylene with a molecular weight of < 3.5 g/mol. It has great wear resistance, high impact strength, and excellent sliding properties ideal ..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
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Okulen® 1000 PE-UHMW, Conductive
OKULEN® 1000 is an ultra high molecular low pressure polyethylene with a molecular weight of < 3.5 g/mol. It has great wear resistance, high impact strength, and excellent sliding properties ideal ..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
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Okulen® 500 - REG PE Multicoloured fine
OKULEN® 500 is a high molecular low pressure polyethylene with a molecular weight of approximately 500 g/mol. Applications include the food industyr and sports center construction. It does an excel..
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| CTE, linear |
200
µm/m-°C @Temperature 23.0 - 60.0 °C |
111
µin/in-°F @Temperature 73.4 - 140 °F |
|
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Omnia Plastica PE 1000 - Polyethylene 1000
Polyethylene with a molecular weight of ± 1000,000 with excellent impact strength. PE 1000 is less rigid and has a higher shock resistance than the low molecular weight polyethylene and it is there..
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| CTE, linear |
200
µm/m-°C @Temperature 23.0 - 60.0 °C |
111
µin/in-°F @Temperature 73.4 - 140 °F |
|
|
Omnia Plastica PE 500 - Polyethylene 500
Polyethylene with a molecular weight of ± 500,000. PE 500 is more rigid than the high molecular weight polyethylene and it is therefore more suitable for mechanical applications. The friction coeff..
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| CTE, linear |
200
µm/m-°C @Temperature 23.0 - 100 °C |
111
µin/in-°F @Temperature 73.4 - 212 °F |
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Quadrant EPP TIVAR® 1000 ASTL PE-UHMW + specific additives (ISO Data)
TIVAR 1000 ASTL, based on a PE-UHMW grade with extremely high molecular weight, has been specifically developed for tough anti-abrasion applications. TIVAR 1000 ASTL shows a higher wear and abrasion..
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| CTE, linear |
200
µm/m-°C @Temperature 23.0 - 100 °C |
111
µin/in-°F @Temperature 73.4 - 212 °F |
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Quadrant EPP TIVAR® H.O.T. PE-UHMW + specific additives (ISO Data)
TIVAR H.O.T. [Higher Operating Temperature] is formulated to maintain inherent PE-UHMW key properties over an extended service temperature range, in this way considerably increasing part life in low..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | ASTM E831 |
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Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Material
Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
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3M Dyneon™ Fluorel™ FC-2144 Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Higher viscosity version of FC-2123. ..
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
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3M Dyneon™ Fluorel™ FC-2152 Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Improved hot tear over FC-2176. Sugg..
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
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3M Dyneon™ Fluorel™ FLS-2530 Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 69%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. High fluorine dipolymer with improved f..
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
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3M Dyneon™ Fluorel™ FC-2120 Fluoroelastomer VF2 + HFP Dipolymer
(discontinued **)
Data provided by the manufacturer, Dyneon LLC.Incorporated cure polymer, 65.9%F in polymer with 22% Medium Thermal Carbon Black (N990), 2% MgO, and 4% Ca(OH)2. Dipolymer for difficult extrusions. ..
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 - 100 °C |
111
µin/in-°F @Temperature 68.0 - 212 °F |
DIN 53752 |
|
Polikim ULPOLEN® 1000 UHMWPE, Oil
The solid lubricant additive reduces Ulpolen®'s coefficient of friction even further. As the additive is dry, it does not accumulate dust or dirt. In conveyor belts, it reduces squeakings at corner..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
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Okulen® 1000 - REG PE Multicoloured fine
OKULEN® 1000 is an ultra high molecular low pressure polyethylene with a molecular weight of < 3.5 g/mol. It has great wear resistance, high impact strength, and excellent sliding properties ideal ..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
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Okulen® 2000 PE-UHMW, OF
OKULEN® 2000 is an ultra high molecular low pressure polythylene with a molecular weight of > 7.000.000 g/mol plus additives for the improvement of specific material properties. It has an antistati..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 52328 |
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Isoflon PEHD 1000 High Density Polyethylene
Products with excellent friction, anti-stick, abrasion and chemical inertia characteristicsVery good impact resistanceNo moisture regainProduct for the food industryInformation provided by Isoflon.
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
|
Momentive Performance Materials RTV577 White Extreme Low Temperature Potting/Encapsulating Compound
Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
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Momentive Performance Materials RTV8262 Silicone Rubber Compounds for Potting, Encapsulating and Sealing
RTV8111, RTV8112 and RTV8262 silicone rubber compounds are two-part silicone elastomers supplied in ready-to-use matched kits containing a base compound and curing agent.Mechanical and electrical pr..
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
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Momentive Performance Materials RTV560 Silicone Rubber Compound for Low Temperature Potting, Encapsulating and Sealing, Red
RTV511, RTV560 and RTV577 silicone rubber compounds are low temperature two-part silicone elastomers. They are supplied ready to use with a base compound and DBT (dibutyl tin dilaurate) as the stand..
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 °C |
111
µin/in-°F @Temperature 68.0 °F |
|
|
Momentive Performance Materials RTV60 Red Extreme High Temperature Potting/Encapsulating Compound
Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | Above Tg |
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Tra-Con Tra-Bond Ablebond 862-2 Room Temperature Cure Epoxy Adhesive
Ablebond 862-2 room temperature curing epoxy adhesive is designed for solder pad encapsulation or sealing the head/disk area in floppy disc assemblies. This resilient compound is suitable for bondin..
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| CTE, linear |
200
µm/m-°C @Temperature 20.0 - 60.0 °C |
111
µin/in-°F @Temperature 68.0 - 140 °F |
TMS2 Perkin Elmer |
|
Arkema Group Orgalloy® LE 60LMXV Polyamide 6 Alloy
Polyamide Alloy, Semi-Flexible grade, Nylon 6 basedTubes / Mandrels / Profiles / CablesInformation provided by Arkema Group
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | DIN 53752 |
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Okulen® 500 PE-HMW, Natural
OKULEN® 500 is a high molecular low pressure polyethylene with a molecular weight of approximately 500 g/mol. Applications include the food industyr and sports center construction. It does an excel..
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| CTE, linear | 200 µm/m-°C | 111 µin/in-°F | |
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Resinlab® UR3010 Clear Polyurethane Potting System
Resinlab™ UR 3010 Clear is a, two component, room temperature curing polyurethane potting system. It is designed to cure completely at room temperature. UR 3010 provides excellent environmental pro..
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