Thermal Properties | Metric | English | Comments |
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CTE, linear | 150 µm/m-°C @Temperature 23.0 - 60.0 °C |
83.3 µin/in-°F @Temperature 73.4 - 140 °F |
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Omnia Plastica PP Polypropylene The mechanical features of PP are better than those of PE H.D. It withstands attack by alkali and acids and consequently it is widely used for components in the chemical industry when a moderate str.. |
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CTE, linear | 150 µm/m-°C @Temperature 23.0 - 100 °C |
83.3 µin/in-°F @Temperature 73.4 - 212 °F |
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Quadrant EPP PE 500 PE-HMW, virgin (ISO Data) This grade exhibits a good combination of stiffness, toughness, mechanical damping ability with wear- and abrasion resistance and can easily be welded. In less demanding applications with respect to.. |
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CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | ASTM E831 |
Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | ASTM E831 |
Parker Chomerics THERM-A-GAP™ GEL 8010 High Performance Fully Cured Dispensable Gel Description: Parker Chomerics fully cured dispensable GELs eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) compl.. |
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CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Petromont 1100 High Density Polyethylene Resin Petromont HDPE 1100 is a high-density polyethylene homopolymer resin produced using the UNIPOL® Process. This multi-purpose resin is intended primarily for use in most intermittent and continuous b.. |
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CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
ISO 11359-2 |
Chevron Phillips Xtel® XE3200NA Polyphenylene Sulfide Alloy
(discontinued **) Xtel® XE3200NA is an un-reinforced high performance, PPS based alloy developed to provide exceptionally high ductility and impact resistance along with good thermal stability.Information provided b.. |
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CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
GEHR Plastics PE-HD Polyethylene HDPE Polyethylene has a good chemical resistance against almost all acids and bases, detergents and hot water. PE has good insulation properties and is easy to weld. The operating temperature is from -50.. |
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CTE, linear | 150 µm/m-°C @Temperature 0.000 - 70.0 °C |
83.3 µin/in-°F @Temperature 32.0 - 158 °F |
DIN 53752 |
Borealis RA130E Polypropylene Random Copolymer RA130E is a high molecular weight, low melt flow rate polypropylene random copolymer (PP-R) compound and is natural colored. Applications RA130E is recommended for the production of PP-R pipes and .. |
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CTE, linear | 150 µm/m-°C @Temperature 0.000 - 70.0 °C |
83.3 µin/in-°F @Temperature 32.0 - 158 °F |
DIN 53752 |
Borealis RA130E-6017 Polypropylene Random Copolymer RA130E-6017 is a high molecular weight, low melt flow rate polypropylene random copolymer (PP-R) compound and is green colored. Applications: domestic water, heating, relining, plumbing, and indust.. |
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CTE, linear | 150 µm/m-°C @Temperature 0.000 - 70.0 °C |
83.3 µin/in-°F @Temperature 32.0 - 158 °F |
DIN 53752 |
Borealis RA130E-6034 Polypropylene Random Copolymer RA130E-6034 is a high molecular weight, low melt flow rate polypropylene random copolymer (PP-R) compound and is green colored. Applications: domestic water, heating, relining, plumbing, and indust.. |
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CTE, linear | 150 µm/m-°C @Temperature -30.0 - 30.0 °C |
83.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM E831 |
A. Schulman POLYPUR™ FPU 1117 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 150 µm/m-°C @Temperature -30.0 - 30.0 °C |
83.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM E831 |
A. Schulman POLYPUR™ FPU 1117 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | Above Tg |
Tra-Con Tra-Bond 224-1 Rapid Room Temperature Cure Epoxy Adhesive TRA-BOND 224-1 room temperature curing epoxy adhesive develops structural strength rapidly. Unlike most "rapid cure" epoxies which gel in one or two minutes, TRA-BOND 224-1 adhesive exhibits a 30 mi.. |
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CTE, linear | 150 µm/m-°C @Temperature 0.000 - 70.0 °C |
83.3 µin/in-°F @Temperature 32.0 - 158 °F |
DIN 53752 |
Borealis RA130E-6020 Polypropylene Random Copolymer RA130E-6020 is a high molecular weight, low melt flow rate polypropylene random copolymer (PP-R) compound and is green colored. Applications: domestic water, heating, relining, plumbing, and indust.. |
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CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | ASTM D696 |
Eastman Eastman AP007 Copolyester Applications:Automotive componentsBreathable filmsElectronic componentsFilm ModificationFlexible hingesHose mandrelIndustrial componentsOffice furniturePackagingPolymer modificationProfilesRubber an.. |
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CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
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Cytec EN-2523 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
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CTE, linear | 150 µm/m-°C @Temperature -20.0 - 32.0 °C |
83.3 µin/in-°F @Temperature -4.00 - 89.6 °F |
ASTM D696 |
DuPont™ Surlyn® 8660 Ionomer Resin, Sodium Surlyn® 8660 thermoplastic resin is an advanced ethylene/methacrylic acid (E/MAA) copolymer, in which the MAA acid groups have been partially neutralized with sodium ions. The amount of MAA and neu.. |
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CTE, linear | 150 µm/m-°C @Temperature -20.0 - 32.0 °C |
83.3 µin/in-°F @Temperature -4.00 - 89.6 °F |
ASTM D696 |
DuPont™ Surlyn® 9650 Ionomer Resin, Zinc Surlyn® 9650 thermoplastic resin is an advanced ethylene/methacrylic acid (E/MAA) copolymer, in which the MAA acid groups have been partially neutralized with zinc ions. The amount of MAA and neutr.. |
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CTE, linear | 150 µm/m-°C @Temperature -20.0 - 32.0 °C |
83.3 µin/in-°F @Temperature -4.00 - 89.6 °F |
ASTM D696 |
DuPont™ Surlyn® 9950 Ionomer Resin, Zinc Surlyn® 9950 thermoplastic resin is an advanced ethylene/methacrylic acid (E/MAA) copolymer, in which the MAA acid groups have been partially neutralized with zinc ions. The amount of MAA and neutr.. |
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CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® H61 Unfilled Epoxy Adhesive Material Description: A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of E.. |
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CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
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Arkema Group Rilsan® Fine Powders Grey 49 Polyamide 11 Rilsan® fine powder coatings offer weatherability, long-lasting adhesion, chalk resistance, chemical resistance to aliphatic hydrocarbons, bases, salt solutions, oils, greases and other petroleum p.. |
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CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
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Arkema Group Rilsan® Fine Powders Polyamide 11 Rilsan® fine powder coatings offer weatherability, long-lasting adhesion, chalk resistance, chemical resistance to aliphatic hydrocarbons, bases, salt solutions, oils, greases and other petroleum p.. |
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CTE, linear | 150 µm/m-°C @Temperature 20.0 - 160 °C |
83.3 µin/in-°F @Temperature 68.0 - 320 °F |
Silicone Property; ASTM E 831 |
Arlon Thermabond® 48A43X008 0.008"(0.203 mm) Cured Silicone Rubber with Fiberglass Substrate Description: Thermabond® Electrically insulating, thermally conductive, thermal interface material (TIM).Design/Construction: Side 1: Cured Silicone RubberSubstrate: Style 1080 FiberglassSide 2: Cu.. |
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CTE, linear | 150 µm/m-°C @Temperature -30.0 - 30.0 °C |
83.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM E831 |
A. Schulman POLYPUR™ CB 1110 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | |
Resinlab® UR3001 Clear Two Part Urethane Encapsulant Resinlab™ UR 3001 is a clear, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR 3001 provides excellent environmental p.. |