Polymer Property : Cure Time = 240 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
NextGen Adhesives G907-24 Structural Epoxy Adhesive Description: NGAC G907-24 is a medium viscosity and near transparent adhesive system that is specifically formulated for structural applications requiring excellent wetting, mechanical strength and ..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
NextGen Adhesives G907-27 Structural Adhesive Description: NGAC G907-27 is a medium viscosity polyamide adhesive system utilized extensively in industrial and structural applications.Advantages and Applications: The NGAC G907-27 provides excell..
Cure Time	240 min @Temperature 22.0 °C	4.00 hour @Temperature 71.6 °F	50% RH; Tack Free Time
Parker Chomerics CHO-FORM 5526 EMI Shielding Material Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
Cure Time	>= 240 min @Temperature 25.0 °C	>= 4.00 hour @Temperature 77.0 °F	De-mold Time
Northstar Polymers MPP-A80H Room-Temperature Curable Polyurethane MPP-A80H has been specifically formulated to service applications where high elongation and good physical strength are required as well as where temperature during the process must be low for a very..
Cure Time	240 - 300 min @Temperature 25.0 °C	4.00 - 5.00 hour @Temperature 77.0 °F	De-mold Time
Northstar Polymers MYP-V40A Polyurethane Filler Gel This polyurethane casting material is developed for applications that require inexpensive liquid resin filler such as encapsulation of a large electric components or puncture-free tire for low-speed..
Cure Time	240 - 360 min @Temperature 93.3 °C	4.00 - 6.00 hour @Temperature 200 °F
Master Bond EP29LP Low Exotherm, Low Viscosity Two Component Epoxy System Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bon..
Cure Time	240 min @Temperature 75.0 °C	4.00 hour @Temperature 167 °F
Tra-Con Tra-Bond 342-3.5 Room Temperature Cure Epoxy Adhesive TRA-BOND 342-3.5 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials such ..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 5126 Medium Viscosity Aerospace-Grade Epoxy Adhesive TRA-BOND 5126 AEROSPACE-GRADE EPOXY ADHESIVE is a two-part, clear (amber), medium viscosity, aerospace-grade epoxy adhesive system recommended for bonding a wide variety of materials for structural ..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond FS163 Medium Viscosity Epoxy/Polyamide Adhesive TRA-BOND FS163 is a medium viscosity polyamide/epoxy adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are r..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond FS227 Thixotropic Epoxy/Polyamide Adhesive TRA-BOND FS227 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wettin..
Cure Time	240 min @Temperature 75.0 °C	4.00 hour @Temperature 167 °F
Tra-Con Tra-Bond GA47-2LV Instrument Adhesive TRA-BOND GA47-2LV low viscosity adhesive is designed for guidance instrument applications. This adhesive exhibits excellent compatibility with conventional gyro flotation fluids. TRA-BOND GA47-2LV a..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Duct 2919 Room Temperature Conductive, Flexible Silver Epoxy Adhesive TRA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled ..
Cure Time	240 - 360 min @Temperature 25.0 °C	4.00 - 6.00 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 2106T Fast Cure Thixotropic Epoxy Adhesive TRA-BOND 2106T is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. This versatile two-part epoxy system contai..
Cure Time	240 min @Temperature 25.0 °C	4.00 hour @Temperature 77.0 °F	Tack Free
Chesterton ARC 890 Course Grade Sliding Wear Compound An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at the thickness of 6 mm (1/4”)..
Cure Time	240 min @Temperature 25.0 °C	4.00 hour @Temperature 77.0 °F	Tack Free
Chesterton ARC I BX1 Impact & Wear Resistant Epoxy Composite Description: An advanced grade epoxy and urethane composite for the repair and protection of all metal surfaces subjected to severe abrasion and impact. It is normally applied at a thickness of 6 mm..
Cure Time	240 - 300 min @Temperature 25.0 °C	4.00 - 5.00 hour @Temperature 77.0 °F	tack free
Cytec Conathane® CC-1155 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	240 - 300 min @Temperature 25.0 °C	4.00 - 5.00 hour @Temperature 77.0 °F	tack free
Cytec Conathane® CC-1155-35 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	240 min @Temperature 60.0 °C	4.00 hour @Temperature 140 °F
Cytec Conathane® CC-1194 (Conap) Polyurethane Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	240 min @Temperature 100 °C	4.00 hour @Temperature 212 °F
Cytec EN-2543 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Cure Time	240 min @Temperature 10.0 °C	4.00 hour @Temperature 50.0 °F	Full Load
Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th..
Cure Time	240 min @Temperature 227 °C	4.00 hour @Temperature 440 °F	Recommended Postcure Cycle
Arlon 30400N125 0.125" (3.17 mm) Uncured, Unsupported Silicone Rubber on a Kodacel Carrier Design/Construction:Side 1: Uncured Unsupported Silicone Rubber on a Kodacel Carrier Appearance: Translucent silicone rubber on polymer linerThis data represents typical values for the production ma..
Cure Time	240 min @Temperature 204 °C	4.00 hour @Temperature 400 °F	Recommended Post Cure Cycle - After 30 minute ramp up cycle
Arlon 30400R040 0.04" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should..
Cure Time	240 min @Temperature 204 °C	4.00 hour @Temperature 400 °F	Recommended Post Cure Cycle - After 30 minute ramp up cycle
Arlon 30400R060 0.06" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should..
Cure Time	240 min @Temperature 175 °C	4.00 hour @Temperature 347 °F	Alternate Cure
Aremco Aremco-Bond™ 2200 High Performance Epoxide Glass Fiber- and Kevlar-Reinforced, Epoxy-Novolac; High Strength, Excellent Abrasion and Corrosion Resistance
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Atom Adhesives AA-BOND 2113 Epoxy Adhesive AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting characteristics, and adheres strongly to gla..
Cure Time	240 min @Temperature 22.0 °C	4.00 hour @Temperature 71.6 °F	50% RH; Handling Time
Parker Chomerics CHO-FORM 5528 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 2130 Medium Viscosity Epoxy Adhesive TRA-BOND 2130 is a clear, near transparent, medium viscosity epoxy adhesive formulation developed for rigid laminating, sealing and bonding applications where the combination of good wetting plus im..