- HOME
- POLYMER SEARCH
- Polymer Property : Cure Time = 240 min
Polymer Property : Cure Time = 240 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
|
| NextGen Adhesives G907-24 Structural Epoxy Adhesive Description: NGAC G907-24 is a medium viscosity and near transparent adhesive system that is specifically formulated for structural applications requiring excellent wetting, mechanical strength and .. |
|||
| Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
|
| Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
|||
| Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
|
| NextGen Adhesives G907-21 Structural Epoxy Adhesive Description: NGAC G907-21 is a high viscosity and thixotropic adhesive system that is specifically formulated for structural bonding applications: industrial, electronics and aerospace.Advantages an.. |
|||
| Cure Time | 240 min @Temperature 80.0 - 85.0 °C |
4.00 hour @Temperature 176 - 185 °F |
plus 2 hours @ 115-125ºC, plus 2 hours @ 145-155ºC |
| Lord Adhesives Thermosetâ„¢ EP-809 Ignition Coil Impregnating and Encapsulation Epoxy Lord EP-809 is a long working life, heat curing, two component epoxy formulation. It was designed especially for potting high voltage automotive ignition coils. The combination of low viscosity, exc.. |
|||
| Cure Time | 240 - 360 min @Temperature 93.3 °C |
4.00 - 6.00 hour @Temperature 200 °F |
|
| Master Bond EP29LP Low Exotherm, Low Viscosity Two Component Epoxy System Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bon.. |
|||
| Cure Time | 240 - 360 min @Temperature 93.3 °C |
4.00 - 6.00 hour @Temperature 200 °F |
|
| Master Bond EP37-3 Optically Clear, Impact Resistant Two Component Epoxy Master Bond Polymer System EP37-3 is a low viscosity, resilient, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. As an adhes.. |
|||
| Cure Time | 240 min @Temperature 25.0 °C |
4.00 hour @Temperature 77.0 °F |
|
| Tra-Con Tra-Bond 224-1 Rapid Room Temperature Cure Epoxy Adhesive TRA-BOND 224-1 room temperature curing epoxy adhesive develops structural strength rapidly. Unlike most "rapid cure" epoxies which gel in one or two minutes, TRA-BOND 224-1 adhesive exhibits a 30 mi.. |
|||
| Cure Time | 240 min @Temperature 75.0 °C |
4.00 hour @Temperature 167 °F |
|
| Tra-Con Tra-Bond 286-5 Latex Emulsion TRA-BOND 286-5 latex emulsion is designed for temporary sealing of molds to prevent leaking during cure. This compound will thicken gradually due to water evaporation. Store containers with caps sec.. |
|||
| Cure Time | 240 min @Temperature 75.0 °C |
4.00 hour @Temperature 167 °F |
|
| Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se.. |
|||
| Cure Time | 240 min @Temperature 75.0 °C |
4.00 hour @Temperature 167 °F |
|
| Tra-Con Tra-Bond 342-1 Room Temperature Cure Epoxy Adhesive TRA-BOND 342-1 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials, such a.. |
|||
| Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 5126 Medium Viscosity Aerospace-Grade Epoxy Adhesive TRA-BOND 5126 AEROSPACE-GRADE EPOXY ADHESIVE is a two-part, clear (amber), medium viscosity, aerospace-grade epoxy adhesive system recommended for bonding a wide variety of materials for structural .. |
|||
| Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond F156 Optically Opaque Epoxy Adhesive TRA-BOND F156 is a black, solvent-free thixotropic epoxy system recommended for high quality photographic industry bonding, laminating, production and repair applications where a room-temperature cu.. |
|||
| Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 2101 General Purpose Epoxy Adhesive TRA-BOND 2101 is a medium viscosity epoxy formulation recommended for laminating, bonding, repair and other adhesive applications where the combination of its superior structural, mechanical and ele.. |
|||
| Cure Time | 240 min @Temperature 75.0 °C |
4.00 hour @Temperature 167 °F |
|
| Tra-Con Tra-Bond 293-21 General Purpose Epoxy Adhesive TRA-BOND 293-21 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293 s.. |
|||
| Cure Time | 240 min @Temperature 25.0 °C |
4.00 hour @Temperature 77.0 °F |
Light Load |
| Chesterton ARC 988 Composite Description: A high performance, quartz reinforced composite designed to resurface and restore concrete surfaces, to protect new concrete, and to repair concrete damaged by severe chemical and physi.. |
|||
| Cure Time | 240 min @Temperature 25.0 °C |
4.00 hour @Temperature 77.0 °F |
Overcoat Begin |
| Chesterton ARC HT-T Spark Testable High Temperature Trowelable Abrasion Control Compound An advanced ceramic composite formulated to protect equipment from corrosion and erosion in elevated temperature water solution immersion. This system is a high viscosity composite that is applied b.. |
|||
| Cure Time | 240 min @Temperature 25.0 °C |
4.00 hour @Temperature 77.0 °F |
Tack Free |
| Chesterton ARC MXHT High temperature severe wear compound Description: An advanced ceramic composite for the protection of all metal surfaces subjected to severe erosion, abrasion and chemical attack at elevated temperatures. It is applied at a thickness o.. |
|||
| Cure Time | 240 min @Temperature 16.0 °C |
4.00 hour @Temperature 60.8 °F |
Full Load |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
|||
| Cure Time | 240 min @Temperature 32.0 °C |
4.00 hour @Temperature 89.6 °F |
Tack Free |
| Chesterton ARC S1 General purpose coating Description: An advanced polymer composite formulated to protect metal surfaces from corrosion and chmical attack. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrink.. |
|||
| Cure Time | 240 - 960 min @Temperature 120 °C |
4.00 - 16.0 hour @Temperature 248 °F |
|
| Cytec (Conap) FR-1080 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
|||
| Cure Time | 240 min @Temperature 100 °C |
4.00 hour @Temperature 212 °F |
|
| Cytec EN-2523 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
|||
| Cure Time | 240 min @Temperature 100 °C |
4.00 hour @Temperature 212 °F |
|
| Cytec EN-2543 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
|||
| Cure Time | 240 - 360 min @Temperature 80.0 °C |
4.00 - 6.00 hour @Temperature 176 °F |
|
| Cytec EN-9 (Conap) Casting, Potting, and Molding Compound High Technology Potting, Casting and Molding CompoundsTwo-component, polybutadiene-based liquid urethane casting and potting systems. When reacted these high technology systems produce tough, stable.. |
|||
| Cure Time | 240 min @Temperature 227 °C |
4.00 hour @Temperature 440 °F |
Recommended Postcure Cycle |
| Arlon 30400N125 0.125" (3.17 mm) Uncured, Unsupported Silicone Rubber on a Kodacel Carrier Design/Construction:Side 1: Uncured Unsupported Silicone Rubber on a Kodacel Carrier Appearance: Translucent silicone rubber on polymer linerThis data represents typical values for the production ma.. |
|||
| Cure Time | 240 min @Temperature 204 °C |
4.00 hour @Temperature 400 °F |
Recommended Post Cure Cycle - After 30 minute ramp up cycle |
| Arlon 30400R040 0.04" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
|||
| Cure Time | 240 min @Temperature 227 °C |
4.00 hour @Temperature 440 °F |
Recommended Postcure Cycle, after 30 minute ramp up cycle |
| Arlon 32400R060 0.060" (1.52 mm) Uncured Silicone Rubber on PET Carrier Design/Construction:Side 1: Uncured Silicone RubberCarrier: PETInterleave: PolyethyleneAppearance: Red silicone rubber on polymer linerThis data represents typical values for the production material.. |
|||
| Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
|
| Atom Adhesives AA-BOND 2113 Epoxy Adhesive AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting characteristics, and adheres strongly to gla.. |
|||
| Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
|
| Atom Adhesives AA-BOND FDA8 Epoxy Adhesive AA-BOND FDA8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and .. |
|||
| Cure Time | 240 min @Temperature 32.0 °C |
4.00 hour @Temperature 89.6 °F |
Open Time, 90% RH |
| 3M 5200 Marine Adhesive/Sealant 3M™ Marine Adhesive/Sealant 5200 is a one-part polyurethane that chemically reacts with moisture to deliver strong, flexible bonds. It has excellent adhesion to wood, gelcoat and fiberglass. It for.. |
|||
| Cure Time | 240 min @Temperature 227 °C |
4.00 hour @Temperature 440 °F |
Recommended Postcure Cycle, after 30 minute ramp up cycle |
| Arlon 32400N060 0.060" (1.52 mm) Uncured Silicone Rubber Design/Construction: Interleave 1: PET carrierSide 1: Uncured Silicone RubberInterleave 2 : PE carrierAppearance: Translucent silicone rubber on polymer linerThis data represents typical values for .. |
|||
Copyright © lookpolymers.com All Rights Reserved