Polymer Property : Cure Time = 240 min Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
NextGen Adhesives G907-24 Structural Epoxy Adhesive Description: NGAC G907-24 is a medium viscosity and near transparent adhesive system that is specifically formulated for structural applications requiring excellent wetting, mechanical strength and ..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
NextGen Adhesives G907-27 Structural Adhesive Description: NGAC G907-27 is a medium viscosity polyamide adhesive system utilized extensively in industrial and structural applications.Advantages and Applications: The NGAC G907-27 provides excell..
Cure Time	240 min @Temperature 80.0 - 85.0 Â°C	4.00 hour @Temperature 176 - 185 Â°F	plus 2 hours @ 115-125ÂºC, plus 2 hours @ 145-155ÂºC
Lord Adhesives Thermosetâ„¢ EP-809 Ignition Coil Impregnating and Encapsulation Epoxy Lord EP-809 is a long working life, heat curing, two component epoxy formulation. It was designed especially for potting high voltage automotive ignition coils. The combination of low viscosity, exc..
Cure Time	240 - 360 min @Temperature 93.3 °C	4.00 - 6.00 hour @Temperature 200 °F
Master Bond EP37-3 Optically Clear, Impact Resistant Two Component Epoxy Master Bond Polymer System EP37-3 is a low viscosity, resilient, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. As an adhes..
Cure Time	240 - 360 min @Temperature 60.0 - 70.0 °C	4.00 - 6.00 hour @Temperature 140 - 158 °F
Master Bond EP62-1Med USP Class VI Two Component Epoxy Resin System Master Bond EP62-1Med is a two component epoxy system that has an exceptionally long working life at ambient temperatures and cures rapidly at moderately elevated temperatures. It has a 100 to 10 mi..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 2147 Thixotropic Epoxy/Polyamide Adhesive TRA-BOND 2147 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting..
Cure Time	240 min @Temperature 75.0 °C	4.00 hour @Temperature 167 °F
Tra-Con Tra-Bond 293-1.5T General Purpose Instrument Epoxy Adhesive-Flexible TRA-BOND 293-1.5T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This v..
Cure Time	240 min @Temperature 75.0 °C	4.00 hour @Temperature 167 °F
Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se..
Cure Time	240 min @Temperature 75.0 °C	4.00 hour @Temperature 167 °F
Tra-Con Tra-Bond 342-3.5 Room Temperature Cure Epoxy Adhesive TRA-BOND 342-3.5 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials such ..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond FDA8 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food an..
Cure Time	240 min @Temperature 104.4 °C	4.00 hour @Temperature 219.9 °F
Zyvex Performance Materials Arovex™ 250 Carbon Nanotube Strengthened Prepreg Arovex® 250 Prepreg is a 180°F (82°C) to 280°F (138°C) curing carbon nanotube strengthened epoxy prepreg suitable for numerous composites applications. Normal curing takes place at 250°F (121°..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Duct 2919 Room Temperature Conductive, Flexible Silver Epoxy Adhesive TRA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled ..
Cure Time	240 min @Temperature 45.0 °C	4.00 hour @Temperature 113 °F
Trelleborg Emerson & Cuming Eccobond® 24 Two-Component High Strength-Impact Resistant Epoxy Adhesive Emerson & Cuming 24 Eccobond® Two-Component High Strength-Impact Resistant Epoxy AdhesiveClear, low viscosity, room temperature curing, epoxy adhesive. Exhibits resilient bonds when joining dissimi..
Cure Time	240 min @Temperature 45.0 °C	4.00 hour @Temperature 113 °F
Trelleborg Emerson & Cuming Eccobond® 286 Two-Component General Purpose Epoxy Adhesive Emerson & Cuming 286 Eccobond® Two-Component General Purpose Epoxy AdhesiveFilled, general purpose, thermally conductive, epoxy adhesive. Room temperature cure. Convenient mix ratio. Recommended fo..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 216C04 Information provided by Tra-Con Inc.
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Cast 9182A Semi-Rigid Flame Retardant Epoxy Encapsulant TRA-CAST 9182A is a medium viscosity, flame retardant epoxy encapsulant. It adheres well to most electronic and aerospace-industry materials like metals, glass, ceramic, industrial laminates and rig..
Cure Time	240 - 300 min @Temperature 25.0 °C	4.00 - 5.00 hour @Temperature 77.0 °F	tack free
Cytec Conathane® CC-1195 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	240 min @Temperature 100 °C	4.00 hour @Temperature 212 °F
Cytec EN-2521 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Cure Time	240 min @Temperature 100 °C	4.00 hour @Temperature 212 °F
Cytec EN-2527 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Cure Time	240 min @Temperature 10.0 °C	4.00 hour @Temperature 50.0 °F	Full Load
Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th..
Cure Time	240 min @Temperature 22.0 °C	4.00 hour @Temperature 71.6 °F
Dow Corning 3-4154 DIELECTRIC GEL KIT Two-part, clear, RT or heat cure.Information provided by Dow Corning
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Abatron L060421-1 Heat-Resistant (-75~400°F) Non-Flammable Silicone Rubber L060421-1 is a heat-resistant and non-flammable silicone rubber recommended as a potting compound for exceptional protection against thermal shock, vibration, moisture, ozone, dust, chemicals, and o..
Cure Time	240 min @Temperature 227 °C	4.00 hour @Temperature 440 °F	Recommended Postcure Cycle
Arlon 30400N125 0.125" (3.17 mm) Uncured, Unsupported Silicone Rubber on a Kodacel Carrier Design/Construction:Side 1: Uncured Unsupported Silicone Rubber on a Kodacel Carrier Appearance: Translucent silicone rubber on polymer linerThis data represents typical values for the production ma..
Cure Time	240 min @Temperature 175 °C	4.00 hour @Temperature 347 °F	Alternate Cure
Aremco Aremco-Bond™ 2200 High Performance Epoxide Glass Fiber- and Kevlar-Reinforced, Epoxy-Novolac; High Strength, Excellent Abrasion and Corrosion Resistance
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Atom Adhesives AA-BOND 2123 Epoxy Adhesive AA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. AA-BON..
Cure Time	240 min @Temperature 227 °C	4.00 hour @Temperature 440 °F	Recommended Postcure Cycle, after 30 minute ramp up cycle
Arlon 32400R040 0.040" (1.02 mm) Uncured Silicone Rubber on PET Carrier Design/Construction:Side 1: Uncured Silicone RubberCarrier: PETInterleave: PolyethyleneAppearance: Red silicone rubber on polymer linerThis data represents typical values for the production material..
Cure Time	240 min @Temperature 32.0 °C	4.00 hour @Temperature 89.6 °F	Open Time, 90% RH
3M 5200 Marine Adhesive/Sealant 3M™ Marine Adhesive/Sealant 5200 is a one-part polyurethane that chemically reacts with moisture to deliver strong, flexible bonds. It has excellent adhesion to wood, gelcoat and fiberglass. It for..
Cure Time	240 min @Temperature 79.4 °C	4.00 hour @Temperature 175 °F	>2 Hour Air Set Required Prior to Curing
Aremco Corr-Paint™ CP2050-XX High Temperature Protective Coating Epoxy-Phenolic, Glass Fiber Filled This epoxy and urethane based coating is used for producing corrosion and wear resistant barriers to 500 °F. Typical applications include tanks, pipelines, boilers, precipitators, scrubbers, bag ho..
Cure Time	240 min @Temperature 22.0 °C	4.00 hour @Temperature 71.6 °F	50% RH; Handling Time
Parker Chomerics CHO-FORM 5538 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time	240 min @Temperature 25.0 °C	4.00 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 868-6N3 Room Temperature Cure Epoxy Adhesive TRA-BOND 868-6N3 room temperature cure epoxy is a thixotropic version of TRA-BOND 868-6N1 adhesive. This adhesive provides strong bonds to difficult-to-bond metals, such as gold, silver, copper, bra..