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AIM 40Bi/60Sn Solder for Photonic Packaging

Category	Metal , Nonferrous Metal , Bismuth Alloy , Solder/Braze Alloy , Tin Alloy
Manufacturer	AIM Specialty Materials
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	AIM 40Bi/60Sn Solder for Photonic Packaging.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.

Physical Properties	Metric	English	Comments
Density	8.12 g/cc	0.293 lb/in³

Thermal Properties	Metric	English
CTE, linear	14.0 µm/m-°C @Temperature 20.0 °C	7.78 µin/in-°F @Temperature 68.0 °F
Melting Point	138 - 170 °C	280 - 338 °F
Solidus	138 °C	280 °F
Liquidus	170 °C	338 °F

Component Elements Properties	Metric	English	Comments
Bismuth, Bi	40 %	40 %
Tin, Sn	60 %	60 %

Descriptive Properties	Value	Comments
Creep Resistance	Moderate

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