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Devcon Backing Compound Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Devcon
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
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Material Notes:
Abrasion-Resistant SystemData provided by Ellsworth Adhesives.
Physical Properties Metric English Comments
Density 1.61 g/cc
0.0581 lb/in³
Viscosity 4700 cP
4700 cP
with hardener
Mechanical Properties Metric English Comments
Hardness, Shore D 92
92
ASTM D2240
Tensile Strength, Ultimate 37.90 MPa
5497 psi
ASTM D638
Modulus of Elasticity 6.34 GPa
920 ksi
In Tension; ASTM D638
Flexural Yield Strength 59.01 MPa
8558 psi
ASTM D790
Compressive Yield Strength 95.70 MPa
13880 psi
ASTM D695
Adhesive Bond Strength 13.8 MPa
2000 psi
Adhesive tensile shear strength; ASTM D1002
Thermal Properties Metric English Comments
CTE, linear 40.0 µm/m-°C

@Temperature 20.0 °C
 22.2 µin/in-°F

@Temperature 68.0 °F
 ASTM D696
Maximum Service Temperature, Air 121 °C
250 °F
Operating Temperature
Shrinkage 0.10 %
0.10 %
During Cure; ASTM D2566
Processing Properties Metric English Comments
Processing Temperature 21.1 °C
70.0 °F
Pot Life 15.0 min

@Temperature 23.9 °C
 15.0 min

@Temperature 75.0 °F
Descriptive Properties Value Comments
Coverage per 20.3 lb. 347 in²
Mix Ratio by Volume 9 to 1
resin:hardener
Mix Ratio By Weight 100 to 6.84
resin:hardener
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