- HOME
- POLYMER SEARCH
- Adhesive
- Parker Chomerics CHO-SHIELD® 610 Part A Conductive Adhesive
Parker Chomerics CHO-SHIELD® 610 Part A Conductive Adhesive
| Category | Polymer , Adhesive |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-SHIELD® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-SHIELD® 610 Part A Conductive Adhesive.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Information provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | >= 1.00 g/cc | >= 1.00 g/cc | |
| Volatiles | <= 20 % | <= 20 % |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Copper, Cu | <= 45 % | <= 45 % | |
| Silver, Ag | <= 5.0 % | <= 5.0 % |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Epoxy Resin, wt % | 20 - 30 | |
| Physical Form | Gray liquid | |
| Propylene glycol methyl ether acetate, wt. % | 20 - 30 | 108-65-6 |
| Talc wt. % Max | 5 | |
| Vapor Density | Heavier than air |
Users viewing this material also viewed the following:
- Quadrant EPP Nylatron® WP PA (ASTM Product Data Sheet)
- NOVA Chemicals Surpass® HPs900-C Octene sLLDPE Film Resin
- Meilian Chemical PE12055 WHITE MASTERBATCH
- SABIC Innovative Plastics Xenoy® X4820 PBT+PC (Asia Pacific)
- A. Schulman POLYFORT™ FPP 2661 Injection Molding Grade Mineral Fortified Polypropylene
- Polyram Bondyram® TL4101A Maleic Anhydride Modified Polyethylene
- Elgiloy® Co-Cr-Ni Alloy, Strip, 10% Cold Reduction, Heat Treated
- Arlon T1020-R004-## 0.020" Self-Fusing Silicone Rubber Tape
- BASF Octamethylenediamine
Copyright © lookpolymers.com All Rights Reserved