Physical Properties | Metric | English | Comments |
---|---|---|---|
Viscosity | 2.5 cP | 2.5 cP | ASTM D2196 |
Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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Viscosity | 2.5 cP | 2.5 cP | ASTM D2196 |
Parker Chomerics THERM-A-FORM T644 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |