Polymer Property : Viscosity = 27000 cP Product List

Physical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Physical Properties	Metric	English	Comments
Viscosity	27000 - 30000 cP	27000 - 30000 cP
Master Bond EP46HT-1 Epoxy For Serviceability Up To 600°F Description: Master Bond EP46HT-1 is a two component epoxy system for high performance structural bonding and sealing suitable for applications where resistance to temperatures from -100°F to +550°..
Viscosity	27000 cP @Temperature 25.0 °C	27000 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond CA20 Coil-Fix Epoxy Adhesive TRA-BOND CA-20 is a thixotropic epoxy adhesive system specially formulated for shorted turns, damaged end wire extensions, or other coil repair applications where a high-fill, non-sag adhesive is re..
Viscosity	27000 cP @Temperature 25.0 °C	27000 cP @Temperature 77.0 °F	Mixed (cp #52, 10 rpm)
Tra-Con Tra-Duct 916D01 Electrically Conductive Silver-Filled Epoxy TRA-DUCT 916D01 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical pr..
Viscosity	27000 cP	27000 cP
Dymax 910 Strain Relief, Wire and Parts Tacking Adhesive High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 910 Strain Relief, Wire and Parts Tacking AdhesiveFlexible, good adhesion and mechanical removable Cure Type: UV
Viscosity	27000 cP	27000 cP	uncured
Atom Adhesives AA-BOND FDA22 Epoxy Adhesive AA-BOND FDA22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administ..
Viscosity	27000 cP	27000 cP
ACC MM913 Condensation Cure 2-Part Molding Rubber Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: high tear strength, picks up extremely fine details, low viscosity, good resistance to styrene attack, easy degassing..