Physical Properties | Metric | English | Comments |
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Viscosity | 15000 - 30000 cP @Temperature 25.0 °C |
15000 - 30000 cP @Temperature 77.0 °F |
Uncured |
Permabond ES562 Epoxy Resin PERMABOND® ES562 is a single-part epoxy adhesive which flows like solder when heated during curing. The adhesive has excellent adhesion to metal surfaces and composites. The high bond strength of t.. |
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Viscosity | 0.0300 - 30000 cP | 0.0300 - 30000 cP | Average value: 5130 cP Grade Count:23 |
Overview of materials for Styrenic Elastomer (TES) This property data is a summary of similar materials in the MatWeb database for the category "Styrenic Elastomer (TES)". Each property range of values reported is minimum and maximum values of appro.. |
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Viscosity | 575 - 30000 cP @Temperature 140 - 190 °C |
575 - 30000 cP @Temperature 284 - 374 °F |
Average value: 5530 cP Grade Count:12 |
Overview of materials for Ethylene Acrylic Acid This property data is a summary of similar materials in the MatWeb database for the category "Ethylene Acrylic Acid". Each property range of values reported is minimum and maximum values of appropri.. |
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Viscosity | 10000 - 30000 cP | 10000 - 30000 cP | |
Huntsman Araldite 94-105 Water-Based Hardener Base Resin is ECN 1280. Typical Solids Content 55%. Mean Particle Size 2µm. Weight per Epoxide (EEW, g/eq), solids basis, 230 to 251.Comments/Applications: Adhesives; Fiber-Sizing; Textiles; A.. |
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Viscosity | 15000 - 30000 cP @Temperature 25.0 °C |
15000 - 30000 cP @Temperature 77.0 °F |
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Lucite International Colacryl ® TS1631 Acrylic Solution Resin Acrylic copolymer with reactive groupsA highly flexible resin with good handle. It exhibits good adhesion, resistance to ageing and light stability.Suggested Use: Coating and lamination of nylon and.. |
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Viscosity | 10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 25.0 °C |
10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 77.0 °F |
Bohlin CVO 100 |
Gwent Electronic Materials C2110127D3 Nanocopper based Paste This product is a nanocopper based paste for screen printing that is compatible with low temperature substrates such as paper. Produced using nanoparticles of negligible oxide content resulting in a.. |
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Viscosity | 10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 25.0 °C |
10000 - 30000 cP @Shear Rate 50.0 1/s, Temperature 77.0 °F |
Bohlin CVO 100 |
Gwent Electronic Materials C2121119D9 Nanocopper based Paste This product is a nanocopper based paste that is designed for flat bed screens. The product is compatible with printing on PET substrates such as the DuPont Melinex ST-505. Produced using nano-par.. |
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Viscosity | 10000 - 30000 cP @Temperature 40.0 °C |
10000 - 30000 cP @Temperature 104 °F |
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Taiwan PU Corporation PTMG CPU-100L Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu.. |
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Viscosity | 20000 - 30000 cP | 20000 - 30000 cP | 30% solid in Anone |
Taiwan Sheen Soon Sheenthane® A7810H TPU for Ink Thermoplastic polyurethane elastomer for inkAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen printing, and spray applicati.. |
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Viscosity | 20000 - 30000 cP | 20000 - 30000 cP | 30% solid in Anone |
Taiwan Sheen Soon Sheenthane® A8510H TPU for Ink Thermoplastic polyurethane elastomer for inkAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen printing, and spray applicati.. |
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Viscosity | 20000 - 30000 cP | 20000 - 30000 cP | 30% solid in Anone |
Taiwan Sheen Soon Sheenthane® A8511H TPU for Ink Thermoplastic polyurethane elastomer for inkAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen printing, and spray applicati.. |
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Viscosity | 20000 - 30000 cP | 20000 - 30000 cP | 30% solid in Anone/MEK |
Taiwan Sheen Soon Sheenthane® A9513H TPU for Ink Thermoplastic polyurethane elastomer for inkAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen printing, and spray applicati.. |
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Viscosity | 25000 - 30000 cP @Temperature 23.0 °C |
25000 - 30000 cP @Temperature 73.4 °F |
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Master Bond EP21FRSPLV Flame Resistant Two Component Epoxy Master Bond Polymer System EP21FRSPLV is a two component, room temperature curable, flame resistant compound for potting, encapsulating and casting. EP21FRSPLV has a one to one mix ratio, by weight... |
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Viscosity | 20000 - 30000 cP | 20000 - 30000 cP | Part A |
Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl.. |
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Viscosity | 27000 - 30000 cP | 27000 - 30000 cP | |
Master Bond EP46HT-1 Epoxy For Serviceability Up To 600°F Description: Master Bond EP46HT-1 is a two component epoxy system for high performance structural bonding and sealing suitable for applications where resistance to temperatures from -100°F to +550°.. |
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Viscosity | 15000 - 30000 cP | 15000 - 30000 cP | Part A |
Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical.. |
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Viscosity | 20000 - 30000 cP @Temperature 23.0 °C |
20000 - 30000 cP @Temperature 73.4 °F |
10 rpm |
Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. Advantages & Application Notes: Paste-like viscosity allows for application by dispensing.. |
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Viscosity | 20000 - 30000 cP @Temperature 23.0 °C |
20000 - 30000 cP @Temperature 73.4 °F |
10 rpm |
Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical.. |
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Viscosity | 10000 - 30000 cP | 10000 - 30000 cP | |
Beijing Ranger Chem SM-634X90 Solvent Based Epoxy Resin Information provided by Beijing Ranger Chemical Co. |