Polymer Property : Thickness = 12.0 microns Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Thickness	12.0 microns	0.472 mil	Â± 4.0%; ASTM-252-78
Kinlead PL11 Lamination Grade BOPP Plain Film (thickness: 12 Âµm) PL11 is a general, lamination grade BOPP plain film. It is transparent and non heat sealable. It is excellent for extrusion lamination. One side has corona treatment. It is widely used in laminating..
Thickness	12.0 microns	0.472 mil	Â± 4.0%; ASTM-252-78
Kinlead PL21 Lamination Grade BOPP Plain Film (thickness: 12 Âµm) PL21 is a general, lamination grade BOPP plain film. It is transparent and non heat sealable. It is excellent for extrusion lamination. It has excellent dimensional stability, high tensile strength,..
Thickness	12.0 microns	0.472 mil	Fired
Lord Adhesives Metech 3501 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc..
Thickness	12.0 microns	0.472 mil	Fired
Lord Adhesives Metech 3502 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc..
Thickness	12.0 microns	0.472 mil	Fired
Lord Adhesives Metech 3503 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc..
Thickness	12.0 microns	0.472 mil	Fired
Lord Adhesives Metech 3504 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc..
Thickness	12.0 microns	0.472 mil	Fired
Lord Adhesives Metech 3505 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc..
Thickness	12.0 - 14.0 microns	0.472 - 0.551 mil	Fired
Lord Adhesives Metech 3541 Platinum Silver Conductor Composition These conductor compositions employ a state of the art mixed bond frit system to enhance adhesion and conductivity values while offering a range of cost effective conductors compatible with most res..
Thickness	12.0 - 14.0 microns	0.472 - 0.551 mil	Fired
Lord Adhesives Metech 3542 Platinum Silver Conductor Composition These conductor compositions employ a state of the art mixed bond frit system to enhance adhesion and conductivity values while offering a range of cost effective conductors compatible with most res..
Thickness	12.0 - 14.0 microns	0.472 - 0.551 mil	Fired
Lord Adhesives Metech 3543 Platinum Silver Conductor Composition These conductor compositions employ a state of the art mixed bond frit system to enhance adhesion and conductivity values while offering a range of cost effective conductors compatible with most res..
Thickness	12.0 microns	0.472 mil	Cured, Typical, Printed through 230 stainless steel mesh with 13 micron emulsion
Gwent Electronic Materials C2030408P3 Carbon Graphite Ink This product is designed to be used for screen printing working electrodes. This is a carbon/graphite ink which has been optimized to give superior electrochemical performance and contains Cobalt Ph..
Thickness	12.0 microns	0.472 mil	Cured, Printed through 230 stainless steel mesh with 13 micron emulsion
Gwent Electronic Materials C2030519P4 Carbon Graphite Ink This product is designed to be used for screen printed working electrodes. It gives excellent electrochemical performance with good reversibility when using cyclic voltammetry.This ink can be used i..
Thickness	12.0 - 14.0 microns	0.472 - 0.551 mil	Fired
Lord Adhesives Metech 3540 Platinum Silver Conductor Composition These conductor compositions employ a state of the art mixed bond frit system to enhance adhesion and conductivity values while offering a range of cost effective conductors compatible with most res..
Thickness	12.0 microns	0.472 mil
SCG Chemicals EL-Leneâ„¢ F15 High Density Polyethylene Film Key Characteristics:High productivityHigh tensile strengthHigh dart impactHigh stiffnessLow gel contentGood moisture barrierExcellent printabilityRecommended Applications:High speed processingWide l..
Thickness	12.0 microns	0.472 mil
SCG Chemicals EL-Leneâ„¢ H5604F High Density Polyethylene Film Key Characteristics:High tensile strengthHigh dart impactHigh stiffnessLow gel contentGood moisture barrierRecommended Applications: Films for shopping bag, T-shirt bag, garbage bag, liner bagInfor..
Thickness	12.0 microns	0.472 mil
SCG Chemicals EL-Leneâ„¢ H5615F High Density Polyethylene Film Key Characteristics:High speed processingHigh tensile strengthHigh dart impactLow gel contentGood moisture barrierRecommended Applications: Ultra thin film (
Thickness	12.0 microns	0.472 mil	Critical Film Thickness; AGFP Method
Asahi Glass Fluon® AD1 PTFE Aqueous Dispersion Fluon®PTFE aqueous dispersions are useful for glass cloth coating, metal coating, binder, additive in resin, feedstock of heat resistive paint ,etc.Information provided by Asahi Glass Company, Inc...
Thickness	12.0 microns	0.472 mil	for samples tested on this data sheet
Total XSene® HD55110 High Density Polyethylene - Blown Film HDPE HD55110 is a bimodal high density polyethylene with a particular molecular design developed with Total Petrochemicals Double Loop Technology™.HDPE HD55110 has been especially designed for appl..
Thickness	12.0 - 96.5 microns	0.472 - 3.80 mil	Average value: 31.9 microns Grade Count:361
Overview of materials for Polypropylene, Film Grade This property data is a summary of similar materials in the MatWeb database for the category "Polypropylene, Film Grade". Each property range of values reported is minimum and maximum values of appr..