Physical Properties | Metric | English | Comments |
---|---|---|---|
Brookfield Viscosity | 14000 - 24000 cP | 14000 - 24000 cP | Spindle 14 @ 10rpm |
Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is.. |