Polymer Property : Brookfield Viscosity = 24000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Brookfield Viscosity	14000 - 24000 cP	14000 - 24000 cP	Spindle 14 @ 10rpm
Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is..