Polymer Property : Adhesive Bond Strength = 13.1 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	13.1 MPa	1900 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; Mixed 1:1; TM R050-37
Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature..
Adhesive Bond Strength	13.1 MPa	1900 psi	lap shear (bond line thickness of 0.005"); ASTM D1002
ITW Devcon 5 minuteÂ® Epoxy, Light Amber Information provided by ITW Devcon
Adhesive Bond Strength	13.1 MPa	1900 psi	Lap shear, alum to alum, 2 hrs @ 65°C
Tra-Con Tra-Bond 2112 Rigid Epoxy Staking Compound TRA-BOND 2112 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
Adhesive Bond Strength	13.1 MPa	1900 psi	Lap shear, alum to alum, 2 hrs @ 65°C
Tra-Con Tra-Bond 216D02 Thixotropic No-Sag Epoxy Adhesive TRA-BOND 216D02 is a thixotropic, two part epoxy adhesive formulated specifically for applications where a nonsagging adhesive is required. TRA-BOND 216D02 works in concert with TRA-CAST 3135 to per..
Adhesive Bond Strength	13.1 MPa	1900 psi	Lap shear, alum to alum, 30 min @ 150°C
Tra-Con Tra-Bond 221M02 Information provided by Tra-Con Inc.
Adhesive Bond Strength	13.1 MPa	1900 psi	Lap shear, alum to alum, 2 min @ 150°C
Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunicatio..
Adhesive Bond Strength	13.1 MPa	1900 psi
Trelleborg Emerson & Cuming Eccobond® 104 Two-Component High Temperature Performance Epoxy Adhesive Emerson & Cuming 104 Eccobond® Two-Component High Temperature Performance Epoxy AdhesiveFilled, heat curing, high temperature resistant, epoxy adhesive. Excellent chemical resistance. Maintains hig..
Adhesive Bond Strength	13.1 MPa @Temperature 82.2 °C	1900 psi @Temperature 180 °F	Aluminum-Aluminum tensile shear
Armstrong X-81/A Epoxy Adhesive Information provided by Ellsworth Adhesives.
Adhesive Bond Strength	13.1 MPa	1900 psi	Alum to Alum
Atom Adhesives AA-BOND 2112 Epoxy Adhesive AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..