Mechanical Properties | Metric | English | Comments |
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Tensile Strength, Ultimate | 2.76 MPa | 400 psi | TM R050-36 |
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |
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Tensile Strength, Ultimate | 2.76 - 552 MPa | 400 - 80000 psi | Average value: 45.4 MPa Grade Count:74 |
Overview of materials for Epoxy Encapsulant, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o.. |
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Tensile Strength, Ultimate | 2.76 MPa | 400 psi | |
Valley Adhesives EM-500 High Temperature Application Glue Stick Valley Adhesives EM-500 High Temperature Application Glue StickHi and low temperature general purpose; Bonds P.O.P. displays, porous and non-porous substrates, paper, corrugated boxes, fabrics, and .. |
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Tensile Strength, Ultimate | 2.76 MPa | 400 psi | |
Valley Adhesives EM-900 High Temperature Application Glue Stick Valley Adhesives EM-900 High Temperature Application Glue StickGeneral purpose; Bonds P.O.P. displays, porous and non-porous substrates, paper, corrugated boxes, fabrics, and foams. |
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Tensile Strength, Ultimate | 2.76 MPa | 400 psi | |
Dow Corning HS II BASE & 10:1 CLEAR CATALYST High strength silicone mold making rubber, suited for the detailed reproduction of fiines, art objects and similar items. HS II Base with HS II 10:1 Clear Catalyst is recommended for use with polyes.. |
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Tensile Strength, Ultimate | 2.76 MPa | 400 psi | |
Dow Corning HS III BASE & 10:1 COLORED CATALYST High strength lower durometer silicone mold making rubber, suited for the detailed reproduction of fiines, art objects and similar items. HS III Base with HS III 10:1 Colored Catalyst is recommended.. |
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Tensile Strength, Ultimate | 2.76 MPa | 400 psi | |
Dymax 3089 Solvent-Free Plastic Adhesive Solvent-Free Adhesives for Plastic Assembly in SecondsDymax® Light-Weld® and Ultra 3000 Series UV and UV/Visible Curing Adhesives for plastic assembly provide instant durable bonds to cure a wide .. |
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Tensile Strength, Ultimate | 2.76 MPa | 400 psi | Cured property; ASTM D412 |
Aptek 2100-A7C/B Low modulus urethane staking compound APTEK 2100-A7C/B is a thixotropic, two component, electrically insulating, low modulus urethane system designed for the staking of electrical/electronic components to printed circuit boards. Althoug.. |
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Tensile Strength, Ultimate | 2.76 MPa | 400 psi | |
Dow Corning 3110 SILICONE RUBBER ENCAPSULANT Two-part, white, condensation cure, moderate flow, general purpose encapsulant, cure speed varied by catalyst type and mix ratio.Information provided by Dow Corning |
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Tensile Strength, Ultimate | 2.76 MPa | 400 psi | |
Dow Corning 3-0110 AUTOMOTIVE SEALANT One-part, alkoxy-cure, room temperature vulcanizing (RTV) temperature-silicone sealantInformation provided by Dow Corning |
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Tensile Strength, Ultimate | 2.76 MPa | 400 psi | TM R050-36 |
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |