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- Polymer Property : CTE, linear, Parallel to Flow = 20.6 µin/in-°F
Polymer Property : CTE, linear, Parallel to Flow = 20.6 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear, Parallel to Flow | 37.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
20.6 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D 696 |
| SABIC Innovative Plastics LNP Thermocomp FF008L PE LNP* Thermocomp* FF008L is a compounding based on Polyethylene containing glass fiber. Added characteristics include Low Extractible.This data was supplied by SABIC-IP for the Americas region. |
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| CTE, linear, Parallel to Flow | 37.0 µm/m-°C | 20.6 µin/in-°F | ASTM E831 |
| Sumitomo Bakelite North America Epiall® 1908-1 Short Glass Fiber Reinforced Epoxy Epiall 1908-1 is a short fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength properties and good electrical insulation proper-ties that meets the requir.. |
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| CTE, linear, Parallel to Flow | 37.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
20.6 µin/in-°F @Temperature 73.4 - 140 °F |
ISO 11359-2 |
| SABIC Innovative Plastics LNP THERMOCOMP MFB82I PP (Europe-Africa-Middle East) LNP* Thermotuf* MFB82I is a compound based on Polypropylene resin containing Glass Fiber, Glass Bead. |
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| CTE, linear, Parallel to Flow | 37.0 µm/m-°C @Temperature 20.0 °C |
20.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Sumitomo Bakelite North America 2008A Glass Reinforced Hardware Grade Epoxy Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc. |
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| CTE, linear, Parallel to Flow | 37.0 µm/m-°C | 20.6 µin/in-°F | ASTM E831 |
| Sumitomo Bakelite North America Epiall® 1908B-1 Short Glass Fiber Reinforced Epoxy Epiall 1908B-1 is a short fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength properties and good electrical insulation properties.Information provided .. |
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| CTE, linear, Parallel to Flow | 37.1 µm/m-°C @Temperature -30.0 - 30.0 °C |
20.6 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
| SABIC Innovative Plastics LNP THERMOCOMP JF002 PES LNP THERMOCOMP* JF002 is a compound based on Polyethersulfone resin containing 10% Glass Fiber. |
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