Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 150 - 160 °C | 302 - 320 °F | |
Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A flame retardant, novolac-hardened epoxy molding compound recommended for semiconductor packages that are not stress sensitive. |
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Glass Transition Temp, Tg | 155 - 160 °C | 311 - 320 °F | Average value: 158 °C Grade Count:3 |
Overview of materials for PEKK, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "PEKK, Unreinforced". Each property range of values reported is minimum and maximum values of appropriate.. |