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Polymer Property : CTE, linear = 38.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 38.0 µm/m-°C

@Temperature 20.0 °C
21.1 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Resinoid 7051 Phenolic Molding, Glass Reinforced
Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
CTE, linear 38.0 µm/m-°C

@Temperature 20.0 °C
21.1 µin/in-°F

@Temperature 68.0 °F
ISO 11359
Teijin Multilon DN-1520B Filler Reinforced Type, Halogen-Free Flame Resistant PC/ABS Polymer Alloy
Halogen-free flame retardant PC/ABS polymer alloy, and is also antimony-free. It has improved stiffness through the addition of 20 % filler. Improved stiffness and high fluidity realizes a thin wall..
CTE, linear 38.0 µm/m-°C
21.1 µin/in-°F
via TMA
Specialty Coating Systems Parylene D Poly (P-Xylylene) Coating
Parylene D is a polymer of para-xylylene modified by the substitution of chlorine atoms for two of the aromatic hydrogen atoms. Parylene D is similar in properties to Parylene C with the added abili..
CTE, linear 38.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
21.1 µin/in-°F

@Temperature -22.0 - 86.0 °F
TMA
SABIC Innovative Plastics NORYL GTX CRN720V PPE+PA6 (Asia Pacific)
GF20% FR-GTX, Restricted to sell for new customers
CTE, linear 38.0 µm/m-°C

@Temperature 40.0 - 130 °C
21.1 µin/in-°F

@Temperature 104 - 266 °F
TMA; ASTM E831
Plenco 05118-T5 Phenolic, Granular, Compression Molded
PLENCO 05118-T5 is a mineral and graphite filled novolac phenolic molding compound with PTFE, formulated for bearing seals. 05118 provides for a low coefficient of friction, good wear resistance, ve..
CTE, linear 38.0 µm/m-°C

@Temperature 40.0 - 130 °C
21.1 µin/in-°F

@Temperature 104 - 266 °F
TMA; ASTM E831
Plenco 4349 Phenolic, Granular, Transfer Molded
PLENCO 04349 is a heat resistant, mineral filled phenolic molding compound offering optimized cure characteristics, and excellent heat resistant properties. PLENCO 04349 is also formulated to offer ..
CTE, linear 38.0 µm/m-°C

@Temperature 20.0 °C
21.1 µin/in-°F

@Temperature 68.0 °F
Williams Advanced Alloys WS96 Solder
All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys
CTE, linear 38.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
21.1 µin/in-°F

@Temperature -22.0 - 86.0 °F
D696
Zhejiang Juner 301-G15 15% Glass Fibre Reinforced and Flammable Resistant
Applications: Electrons and Electricity: TV Components, Plugs of Computers, Exhaust Fans of Computers, Plugs, Sockets, Shells of Electronics, Framework of Level Output Transformers, Pipe Pedestals, ..
CTE, linear 38.0 µm/m-°C

@Temperature 20.0 °C
21.1 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond 2123 Metal Repair Steel/Epoxy Adhesive
TRA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. This ..
CTE, linear 38.0 µm/m-°C

@Temperature 50.0 - 200 °C
21.1 µin/in-°F

@Temperature 122 - 392 °F
DIN 53 752
Ensinger TECASINT 1021 Polyimide, 15% Graphite Filled (PI)
TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel..
CTE, linear 38.0 µm/m-°C
21.1 µin/in-°F
ASTM D696
Ensinger TECATOR™ GF30 (XP142T) Polyamide-imide (PAI), 30% glass filled, compression molded
TECATOR™ is a high performance melt processable polyamideimide that maintains its excellent mechanical and wear properties in temperature environments exceeding 500°F. Stock shapes from Ensinger ..
CTE, linear 38.0 µm/m-°C

@Temperature 20.0 °C
21.1 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Devcon Magic Bond™ Epoxy Putty
Emergency Repair ProductsComments: Two-part epoxy putty stick seals leaks and repairs gouges in steel, aluminum, wood, fiberglass, concrete and ceramics. Cures rock-hard and can be painted, sanded,..
CTE, linear 38.0 µm/m-°C
21.1 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® EK1000 Epoxy
Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
CTE, linear 38.0 µm/m-°C
21.1 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® EK1000-MP Epoxy
Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
CTE, linear 38.0 µm/m-°C
21.1 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® EK2000 Epoxy
Preliminary Product Information SheetMaterial Description: A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance ..
CTE, linear 38.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
21.1 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM Test
BASF Ultramid® 8233G HS 33% Glass Filled PA6 (Dry)
Ultramid 8233G HS is a heat stabilized, 33% glass fiber reinforced nylon 6 molding compound offering excellent strength, stiffness, high temperature performance and dimensional stability. It is also..
CTE, linear 38.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
21.1 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM Test
BASF Ultramid® 8233G HS BK-102 33% Glass Filled PA6 (Dry)
Ultramid 8233G HS BK-102 is a heat stabilized, weather resistant, 33% glass fiber reinforced PA6 injection molding compound offering excellent strength, stiffness, high temperature performance and d..
CTE, linear 38.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
21.1 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM Test
BASF Ultramid® 8233G HS BK-106 33% Glass Filled PA6 (Dry)
Ultramid 8233G HS BK-106 is a heat stabilized, weather resistant, 33% glass fiber reinforced PA6 injection molding compound offering excellent strength, stiffness, high temperature performance and ..
CTE, linear 38.0 µm/m-°C
21.1 µin/in-°F
ASTM E831
BASF Ultramid® HPN 9233G HS BK 102 33% Glass Filled PA6 (Dry)
Description: Ultramid HPN 9233G HS BK-102 is a heat stabilized, pigmented black, 33% glass reinforced PA6 injection molding grade resin in the High Productivity Nylon Series developed for improved c..
CTE, linear 38.0 µm/m-°C
21.1 µin/in-°F
Atom Adhesives AA-BOND 2123 Epoxy Adhesive
AA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. AA-BON..
CTE, linear 38.0 - 42.0 µm/m-°C

@Temperature 20.0 - 125 °C
21.1 - 23.3 µin/in-°F

@Temperature 68.0 - 257 °F
Bulk Molding Compounds BMC 850 Corrosion Resistant, Flame Retardant Molding Compound
BMC 850 is a high strength, corrosion resistant and flame retardant molding compound. As with all other BMCI compounds, this Series can be supplied in logs, slugs or bulk form.Typical applications a..
CTE, linear 38.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
21.1 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM D696
Beijing Chemical Industry KAIFA® 301-G15 PBT Resin
15% glass fiber reinforced, flame retardantInformation provided by Beijing Chemical Industry Research Institute (Group)
CTE, linear 38.0 - 42.0 µm/m-°C

@Temperature 20.0 - 125 °C
21.1 - 23.3 µin/in-°F

@Temperature 68.0 - 257 °F
Bulk Molding Compounds BMC 851 Corrosion Resistant, Flame Retardant Molding Compound
BMC 851is a high strength, corrosion resistant and flame retardant molding compound. As with all other BMCI compounds, this Series can be supplied in logs, slugs or bulk form.Typical applications ar..
CTE, linear 38.0 µm/m-°C

@Temperature 20.0 °C
21.1 µin/in-°F

@Temperature 68.0 °F
ASTM data
BASF Capron® HPN 9233G HS BK-102 33% Glass-Filled Nylon 6 (Dry)  (discontinued **)
Capron HPN 9233G HS BK-102 is a heat stabilized, pigmented black, 33% glass reinforced nylon 6 injection molding grade resin in the High Productivity Nylon Series developed for improved cycle times ..
CTE, linear 38.0 µm/m-°C

@Temperature 20.0 °C
21.1 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Resinoid 7051 SS Phenolic Molding, Glass Reinforced
Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
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