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Devcon Magic Bond™ Epoxy Putty

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Devcon
Trade Name Magic Bond™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Devcon Magic Bond™ Epoxy Putty.pdf
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Material Notes:
Emergency Repair ProductsComments: Two-part epoxy putty stick seals leaks and repairs gouges in steel, aluminum, wood, fiberglass, concrete and ceramics. Cures rock-hard and can be painted, sanded, machined, tapped or drilled when fully cured. Waterproof formula cures well under water and remains sealed long-term. Mixes quickly, hardens in 30-40 minutes. For plumbing repairs and marine use.Data provided by Ellsworth Adhesives.
Physical Properties Metric English Comments
Density 1.81 g/cc
0.0654 lb/in³
Mechanical Properties Metric English Comments
Hardness, Shore D 75
75
ASTM D2240
Tensile Strength, Ultimate 16.9 MPa
2450 psi
ASTM D638
Modulus of Elasticity 4.83 GPa
700 ksi
In Tension; ASTM D638
Flexural Yield Strength 29.5 MPa
4280 psi
ASTM D790
Compressive Yield Strength 82.7 MPa
12000 psi
ASTM D695
Adhesive Bond Strength 4.83 MPa
700 psi
Adhesive tensile shear strength; ASTM D1002
Thermal Properties Metric English Comments
CTE, linear 38.0 µm/m-°C

@Temperature 20.0 °C
21.1 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Thermal Conductivity 0.519 W/m-K
3.59 BTU-in/hr-ft²-°F
ASTM C177
Maximum Service Temperature, Air 121 °C
250 °F
Operating Temperature
Shrinkage 0.30 %
0.30 %
During Cure; ASTM D2566
Electrical Properties Metric English Comments
Dielectric Constant 28.1
28.1
ASTM D150
Dielectric Strength 11.8 kV/mm
300 kV/in
ASTM D149
Processing Properties Metric English Comments
Processing Temperature 21.1 °C
70.0 °F
Pot Life 20.0 min

@Temperature 23.9 °C
20.0 min

@Temperature 75.0 °F
Descriptive Properties Value Comments
Coverage per lb. 61 in²
at 1/4 inch thick
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