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Polymer Property : Thermal Conductivity = 0.800 W/m-K Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 0.800 W/m-K

@Temperature 13.0 °C
5.55 BTU-in/hr-ft²-°F

@Temperature 55.4 °F
Pyrotek Dense Fused Silica Pre-Cast Shapes
Pyrocast Dense Fused Silica is an economical product for shapes demanding thermal shock resistance at temperatures. Pyrocast DFS stands up to repeated use in molten metal casting in aluminum, coppe..
Thermal Conductivity 0.800 W/m-K

@Pressure 2.07 MPa
5.55 BTU-in/hr-ft²-°F

@Pressure 300 psi
ASTM D5470
Parker Chomerics CHO-SEAL L6303 Conductive Elastomer
Good performance in moderately corrosive environments; material of choice for flange finishes needing “bite-through” for good electrical contact.Molded and ExtrudedRoHS CompliantInformation provid..
Thermal Conductivity 0.800 W/m-K

@Pressure 2.07 MPa
5.55 BTU-in/hr-ft²-°F

@Pressure 300 psi
ASTM D5470
Parker Chomerics CHO-SEAL S6305 Conductive Elastomer
Good performance in moderately corrosive environments; material of choice for flange finishes needing “bite-through” for good electrical contact.Molded and Extruded.RoHS CompliantInformation provi..
Thermal Conductivity 0.800 W/m-K

@Pressure 2.07 MPa
5.55 BTU-in/hr-ft²-°F

@Pressure 300 psi
ASTM D5470
Parker Chomerics CHO-SEAL® 1270 Conductive Elastomer
Description: Material of choice for high-end commercial applications; superior performance, in non-corrosive environments; tear trim compression and injection molding. A low durometer hardness elast..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
ASTM D5470
Parker Chomerics Thermal Greases T650 High-Performance and General Duty Thermal Grease
Description: Chomerics thermal greases offer a range of performance covering the simplest to the most demanding thermal requirements. These materials are screened, stenciled or dispensed and require..
Thermal Conductivity 0.800 - 1.50 W/m-K

@Temperature 80.0 - 121 °C
5.55 - 10.4 BTU-in/hr-ft²-°F

@Temperature 176 - 250 °F
Average value: 1.15 W/m-K Grade Count:2
Overview of materials for Epoxy, Thermally Conductive
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Thermally Conductive". Each property range of values reported is minimum and maximum values of ap..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Cookson Group Plaskon® 1031 Conventional Encapsulant  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discre..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
DIN 52 612
3M Dyneon™ TF 4303 PTFE 15% Graphite Filled  (discontinued **)
Type II PTFE. Applications include sliding surfaces, bearings, seals/gaskets.Data provided by Dyneon.
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Mathis Hot Disc Transient Method
Lord Adhesives Circalokâ„¢ 6703A/B Thermally Conductive Two Part Silicone, Flame Retardant
Circalokâ„¢ 6703 A/B is a low viscosity, high density, thermally conductive, two part silicone. Circalokâ„¢ 6703 A/B is an ideal material for potting or encapsulating densely packed power unit..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant
LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Hot Disc Transient Method
Lord Adhesives Thermosetâ„¢ SC-303 Silicone Encapsulant, Flame Retardant
Lord SC-303 is a two component silicone elastomer that provides excellent thermal conductivity, while retaining the other desirable properties associated with silicones. It is a low viscosity, easil..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Schott N-SF66 Glass
Information Provided by SCHOTT North America, Inc.
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Saint-Gobain COHRlastic® CF1818 Thermally Conductive Silicone Coated Fabric
Description: Conductive silicones expand the use of our products into the electronic assembly market. By the use of special fillers, silicone can be made thermally or electrically conductive. CF1818..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Saint-Gobain COHRlastic® CF1867 Thermally Conductive Silicone Coated Fabric
Description: Conductive silicones expand the use of our products into the electronic assembly market. By the use of special fillers, silicone can be made thermally or electrically conductive. CF1867..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Saint-Gobain COHRlastic® CF1869 Thermally Conductive Silicone Coated Fabric
Description: Conductive silicones expand the use of our products into the electronic assembly market. By the use of special fillers, silicone can be made thermally or electrically conductive. CF1869..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Schott N-LAF33 Glass
Information Provided by SCHOTT North America, Inc.
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Schott N-LAF35 Glass
Information Provided by SCHOTT North America, Inc.
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Tra-Con Tra-Bond 872-7TN1 Flexible Thixotropic Epoxy Adhesive
TRA-BOND 872-7TN1 is a flexible thixotropic epoxy. The high viscosity and long worklife make this material easy to handle. Also, the high thermal conductivity makes this product ideal for electronic..
Thermal Conductivity 0.800 W/m-K

@Temperature 80.0 °C
5.55 BTU-in/hr-ft²-°F

@Temperature 176 °F
Tra-Con Tra-Bond 972-1 Thermally Conductive Flexible Epoxy Adhesive
TRA-BOND 972-1 thermally conductive, flexible epoxy adhesive is designed for bonding materials with mismatched coefficients of thermal expansion.Information provided by Tra-Con Inc.
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Loctite® Output™ 315 Acrylic Adhesive
Thermally Conductive BondersLoctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Dow Corning SC 102
White, non-flowing, highly filled compound, good thermal conductivity.Information provided by Dow Corning
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
through plane; ASTM E1461
DSM Arnite® AV2 370 XL-T PET-GF35
35% Glass Reinforced, Low Outgassing, Thermal conductive material
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® H61ND Thermally Conductive, Electrically Insulating Epoxy
Material Description: A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications.Informa..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Silicone Property; ASTM E 1530
Arlon Thermabond® T20 (99710W008) 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier
Description: 8 mil thick Thermabond® T20 electrically insulating electronic adhesive.Design/Construction: Liner: FEP Product: Uncured Silicone Rubber Carrier: PTFE Coated FiberglassRecommended Prim..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Silicone Property; ASTM E 1530
Arlon Thermabond® T20 (99710W015) 0.015" (0.381 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier
Description: 15 mil thick Thermabond® T20 electrically insulating electronic adhesive.Design/Construction: Liner: FEP Product: Uncured Silicone Rubber Carrier: PTFE Coated FiberglassRecommended Pri..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Silicone Property; ASTM E 1530
Arlon Thermabond® T-20 NP (99770W008) 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier
Description: 8 mil Primerless Thermabond®. T-20 NP. Thermally conductive, electrically insulating electronic adhesive. Bonds with primer.Design/Construction: Liner: FEP Product: Uncured Silicone Ru..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Silicone Property; ASTM E 1530
Arlon Thermabond® T-20 NP (99770W015) 0.015" (0.381 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier
Description: 15 mil Primerless Thermabond®. T-20 NP. Thermally conductive, electrically insulating electronic adhesive. Bonds with primer.Design/Construction:Liner: FEPProduct: Uncured Silicone Rub..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
Aptek 3101 B/C/B Thermally conductive urethane film adhesive
Thermally conductive, electrically insulating hybrid urethane film adhesiveAPTEK 1301 B/C/B is a low modulus, flexible, void free, electrically insulating hybrid urethane film adhesive designed to b..
Thermal Conductivity 0.800 W/m-K
5.55 BTU-in/hr-ft²-°F
in perpendicular (002) direction
Momentive Performance Materials HOPG Graphite Monochromator
Advanced Ceramics' graphite monochromators are highly oriented forms of high purity pyrolytic graphite which diffract x-rays and neutrons with greater efficiency than any other material. In x-r..
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