Polymer Property : Thermal Conductivity = 0.840 W/m-K Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.840 W/m-K	5.83 BTU-in/hr-ftÂ²-Â°F
Schott N-SSK8 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	0.840 W/m-K	5.83 BTU-in/hr-ftÂ²-Â°F	ASTM C-518
Sumitomo Bakelite North America E 8398 Hardware Grade Epoxy Fiberglass and mineral reinforced epoxy molding compound with excellent dimensional stability, good electrical insulation properties, and good strength.Information provided by Vyncolit, a Sumitomo B..
Thermal Conductivity	0.840 W/m-K	5.83 BTU-in/hr-ftÂ²-Â°F
Schott N-KZFS4 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	0.840 W/m-K	5.83 BTU-in/hr-ftÂ²-Â°F
Schott N-LAK8 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	0.840 W/m-K	5.83 BTU-in/hr-ft²-°F
Tra-Con Tra-Bond 2159 Heat Conductive Electrically Insulating Compound TRA-BOND 2159 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards..
Thermal Conductivity	0.840 W/m-K	5.83 BTU-in/hr-ft²-°F
Tra-Con Tra-Bond 2156 Heat Conductive Electrically Insulating Compound TRA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compon..
Thermal Conductivity	0.840 W/m-K	5.83 BTU-in/hr-ft²-°F
Tra-Con Tra-Bond 2158 Heat Conductive Electrically Insulating Compound TRA-BOND 2158 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards..
Thermal Conductivity	0.840 W/m-K	5.83 BTU-in/hr-ft²-°F
Ceradyne Thermo-Sil® HS Fused Silica Fused Silica is an excellent thermal insulator with an extremely low coefficient of thermal expansion. It is excellent for thermal shock applications. The key characteristics of this material are:Hi..
Thermal Conductivity	0.840 W/m-K	5.83 BTU-in/hr-ft²-°F
Atom Adhesives AA-BOND 2156 Epoxy Adhesive AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone..
Thermal Conductivity	0.840 W/m-K	5.83 BTU-in/hr-ft²-°F
Ceradyne Thermo-Sil® Isomolded™ Fused Silica Fused Silica is an excellent thermal insulator with an extremely low coefficient of thermal expansion. It is excellent for thermal shock applications. The key characteristics of this material are:Hi..