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Tra-Con Tra-Bond 2159 Heat Conductive Electrically Insulating Compound

Category Polymer , Thermoset , Epoxy , Epoxy, Thermally Conductive
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 2159 Heat Conductive Electrically Insulating Compound.pdf
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Material Notes:
TRA-BOND 2159 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. TRA-BOND 2159 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured TRA-BOND 2159 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol. Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 2.30 g/cc
2.30 g/cc
Mixed
Solids Content 100 %
100 %
Reactive Solids Content
Viscosity 48000 cP

@Temperature 25.0 °C
48000 cP

@Temperature 77.0 °F
Mixed (10 rpm)
Mechanical Properties Metric English Comments
Hardness, Shore D 45
45
Adhesive Bond Strength 6.21 MPa
900 psi
Lap shear, alum to alum, 24 hrs @ 25°C
8.96 MPa
1300 psi
Lap shear, alum to alum, 4 hrs @ 65°C
Thermal Properties Metric English Comments
Thermal Conductivity 0.840 W/m-K
5.83 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -70.0 °C
-94.0 °F
Glass Transition Temp, Tg 6.00 °C
42.8 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 2.10e+15 ohm-cm
2.10e+15 ohm-cm
3.20e+13 ohm-cm

@Temperature 75.0 °C
3.20e+13 ohm-cm

@Temperature 167 °F
Dielectric Constant 5.9

@Frequency 1000 Hz
5.9

@Frequency 1000 Hz
Dielectric Strength 16.1 kV/mm
410 kV/in
Dissipation Factor 0.010

@Frequency 1000 Hz
0.010

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 120 - 240 min

@Temperature 65.0 °C
2.00 - 4.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 30 min
30 min
Descriptive Properties Value Comments
Color Light Gray
Mix Ratio, parts by weight 100/40
Resin/Hardener
Thixotropic Index 1.8
10 rpm/100 rpm
Working Life hours 3
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