Polymer Property : Thermal Conductivity = 1.55 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English
Thermal Conductivity	1.55 W/m-K	10.7 BTU-in/hr-ft²-°F
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol..
Thermal Conductivity	1.55 W/m-K	10.7 BTU-in/hr-ft²-°F
Resin Technology Group TIGA 920H Flexible Silver Conductive 100 parts resin to 115 parts hardener.TIGA 920-H is a flexible, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications that require high flexibil..
Thermal Conductivity	1.55 W/m-K	10.8 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...