Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 1.55 W/m-K | 10.7 BTU-in/hr-ft²-°F | |
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol.. |
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Thermal Conductivity | 1.55 W/m-K | 10.7 BTU-in/hr-ft²-°F | |
Resin Technology Group TIGA 920H Flexible Silver Conductive 100 parts resin to 115 parts hardener.TIGA 920-H is a flexible, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications that require high flexibil.. |
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Thermal Conductivity | 1.54 W/m-K @Temperature 100 °C |
10.7 BTU-in/hr-ft²-°F @Temperature 212 °F |
overall; Arlon SQA-TMS-054 |
Arlon R37806X030 Silicone Rubber/Fiberglass Interleave: 3 mil PE; Side 2: uncured silicone rubber; Substrate: 162 fiberglass; Side 1: cured silicone rubber |