Polymer Property : Thermal Conductivity = 6.94 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	through-plane, 10103mm sample; ASTM E 1461-07
SABIC Innovative Plastics LNP KONDUIT OX11314 PPS (Asia Pacific) Thermally conductive mineral filled PPS FR compound
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F
Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A flame retardant, novolac-hardened epoxy molding compound recommended for semiconductor packages that are not stress sensitive.
Thermal Conductivity	1.00 - 3.00 W/m-K @Temperature 50.0 - 100 °C	6.94 - 20.8 BTU-in/hr-ft²-°F @Temperature 122 - 212 °F	Average value: 1.94 W/m-K Grade Count:14
Overview of materials for Silicone, Molded, Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Silicone, Molded, Glass Fiber Filled". Each property range of values reported is minimum and maximum val..
Thermal Conductivity	1.00 - 3.3867 W/m-K @Temperature 50.0 - 100 °C	6.94 - 23.504 BTU-in/hr-ft²-°F @Temperature 122 - 212 °F	Average value: 2.08 W/m-K Grade Count:15
Overview of materials for Silicone Rubber This property data is a summary of similar materials in the MatWeb database for the category "Silicone Rubber". Each property range of values reported is minimum and maximum values of appropriate Ma..
Thermal Conductivity	1.00 - 2.00 W/m-K	6.94 - 13.9 BTU-in/hr-ft²-°F	ASTM C177
PolyOne Therma-Tech™ SFC-5000 TC Polyphenylene Sulfide (PPS) (discontinued **) Therma-Tech™ Thermal Management Compounds have been engineered to combine the heat transfer and cooling capabilities of metals with the design freedom, weight reduction and cost advantages of therm..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ftÂ²-Â°F	HOT-DISK \|\| 60x60x3 mm
Lehmann & Voss LUVOCOMÂ® 1/CF/20 Polyamide 66, with carbon fiber Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ftÂ²-Â°F
Schott N-SF1 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ftÂ²-Â°F
Schott N-SF14 Glass Information Provided by SCHOTT North America, Inc.
Thermal Conductivity	1.00 W/m-K @Temperature 90.0 Â°C	6.94 BTU-in/hr-ftÂ²-Â°F @Temperature 194 Â°F
Schott Glass 8337B Borosilicate Glass Borosilicate glass for sealing to Kovar metal and tungsten, highly UV-transmitting photomultiplier and UV detectors The heavy metal content for the elements lead, cadmium, mercury, and hexavalent ..
Thermal Conductivity	1.00 W/m-K @Temperature 121 °C	6.94 BTU-in/hr-ft²-°F @Temperature 250 °F
Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F
Trelleborg Emerson & Cuming Stycast® 4952/25 Two-Component Silicone High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	in plane; ASTM E1461
DSM Stanyl® TC154 PA46 FR(17) Thermal conductive material, Flame Retardant, Heat Stabilized
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	through plane; ASTM E1461
DSM Stanyl® TC155 PA46 FR(17) Thermal conductive material, Flame Retardant, Heat Stabilized
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	ASTM E1530
Eurostar Starflam RF0023E PA66/6, 10% Glass Filled, Injection Molded Starflam RF0023E is a Mineral Flame Retardant, Halogen Free and Phosphorous Free, Glass Fiber Reinforced, Polyamide 66/6 Injection Molding (also known as RF1002Z230EM)Information provided by Polymer..
Thermal Conductivity	1.00 W/m-K @Temperature 100 °C	6.94 BTU-in/hr-ft²-°F @Temperature 212 °F	Silicone Property; ASTM E 1530
Arlon Thermabond® 99A30N008 0.008" (0.203 mm) Uncured Silicone Rubber with PTFE Coated Fiberglass Carrier Description: Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction: Liner: FEPProduct: Uncured Silicone Rubber Carrier..
Thermal Conductivity	1.00 W/m-K @Temperature 100 °C	6.94 BTU-in/hr-ft²-°F @Temperature 212 °F	Silicone Property; ASTM E1530
Arlon Thermabond® R37260N008 0.008" Uncured Silicone Rubber on Fiberglass Carrier Primerless Thermabond®: Electrically insulating, thermally conductive, electronic adhesive. Bonds without primer.Design/Construction:Liner: 1 mil FEPProduct: Uncured Silicone RubberCarrier: 3 m..
Thermal Conductivity	1.00 W/m-K @Pressure 2.07 MPa	6.94 BTU-in/hr-ft²-°F @Pressure 300 psi	ASTM D5470
Parker Chomerics CHO-SEAL® 6502 Conductive Elastomer Description: Highest performance in harsh environments; excellent shielding; best choice for corrosion requirements against aluminum.Molded and ExtrudedRoHS CompliantInformation provided by Chomeric..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F
Resinlab® EP1285HD-14 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	DIN 52612
BASF Ultramid® B3UGM210 GR 22866 10/50% Glass/Mineral Filled PA6 FR (Dry) Description: Halogen- and phosphorus-free injection-molding grade with very high rigidity, low smoke density and outstanding electrical properties.Information provided by BASF