Thermal Properties | Metric | English | Comments |
---|---|---|---|
Liquidus | 170 °C | 338 °F | |
Indium Corp. Indalloy 99 Bismuth-Lead-Tin Solder Alloy Information Provided by Indium Corporation |
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Liquidus | 170 °C | 338 °F | |
Indium Corp. Indalloy 281-338 Bismuth-Tin Solder Alloy Information Provided by Indium Corporation |
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Liquidus | 170 °C | 338 °F | |
AIM 40Bi/60Sn Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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Liquidus | 170 °C | 338 °F | |
AIM 54Sn/26Pb/20In Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |