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AIM 54Sn/26Pb/20In Solder for Photonic Packaging

Category	Metal , Nonferrous Metal , Solder/Braze Alloy , Tin Alloy
Manufacturer	AIM Specialty Materials
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	AIM 54Sn/26Pb/20In Solder for Photonic Packaging.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.

Physical Properties	Metric	English	Comments
Density	8.10 g/cc	0.293 lb/in³

Thermal Properties	Metric	English
CTE, linear	25.0 µm/m-°C @Temperature 20.0 °C	13.9 µin/in-°F @Temperature 68.0 °F
Melting Point	138 - 170 °C	280 - 338 °F
Solidus	138 °C	280 °F
Liquidus	170 °C	338 °F

Component Elements Properties	Metric	English
Indium, In	20 %	20 %
Lead, Pb	26 %	26 %
Tin, Sn	54 %	54 %

Descriptive Properties	Value	Comments
Creep Resistance	Moderate

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