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- Polymer Property : Pot Life = 120 min
Polymer Property : Pot Life = 120 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Pot Life | 120 min | 120 min | Mass: 100g; Mixed 1:2; TM R050-19 |
| Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature.. |
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| Pot Life | >= 120 min | >= 120 min | Mass: 50g; TM R050-19 |
| Resinlab® EP1290 Clear Mineral Filled Epoxy Adhesive Resinlab™ EP1290 Clear is a two part mineral filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-flexible material. It has good wetting to .. |
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| Pot Life | 120 min @Temperature 25.0 °C |
120 min @Temperature 77.0 °F |
150 g mass |
| Resin Technology Group KONA 877 Low Viscosity, Low Shrinkage, Vacuum Grade Casting Resin Mix ratio 1 to 1 by weight.KONA 877 with HARDENER #112 is a versatile epoxy casting system developed for high performance production potting and encapsulating applications where low shrinkage and ra.. |
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| Pot Life | >= 120 min | >= 120 min | Mass: 50g |
| Resinlab® EP691 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP 691 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting.. |
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| Pot Life | >= 120 min | >= 120 min | |
| Abatron 228 A/B Filled Potting Compound
(discontinued **) Filled crack injection and casting resin. Slow neutral gray and most colors. 65% filler heat sink. 2/1 variable ratio.Information provided by Abatron. |
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| Pot Life | 120 - 180 min @Temperature 25.0 °C |
120 - 180 min @Temperature 77.0 °F |
100 gm mass |
| Resin Technology Group TIGA 159 LV-UV Low Viscosity, Quick Gel UV Initiated, Flexible Epoxy Adhesive Mix ratio 2 to 1 by volume.TIGA 159 LV-UV hybrid epoxy system is a low viscosity adhesive designed for small potting applications, bonding, laminating, sealing and structural repair applications whe.. |
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| Pot Life | 120 - 120 min @Temperature 80.0 - 80.0 °C |
120 - 120 min @Temperature 176 - 176 °F |
Average value: 120 min Grade Count:1 |
| Overview of materials for Epoxy, High Temperature This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Mineral Filled". Each property range of values reported is minimum and maximum val.. |
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| Pot Life | 120 min | 120 min | |
| Lord Adhesives 3170 Two-component, high cold strength, cryogenic application Epoxy Adhesive Lord Epoxy AdhesivesLord® Epoxy Adhesives create superior bonds for rubber, SMC, plastics and metals. Our epoxy adhesives are widely used in the automotive industry, over 10 million cars and ligh.. |
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| Pot Life | 120 min @Temperature 25.0 °C |
120 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV6166 Clear Potting/Encapsulating Gel Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth.. |
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| Pot Life | 120 min | 120 min | |
| Tra-Con Tra-Bond 2170T Flexible Plastic Bonder TRA-BOND 2170T is a flexible, high viscosity, thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or alm.. |
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| Pot Life | 120 min | 120 min | 25 grams |
| Tra-Con Tra-Bond F123MV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123 MV is a fast cure, medium viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminati.. |
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| Pot Life | 120 min | 120 min | 100 grams |
| Tra-Con Tra-Bond F123MV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123 MV is a fast cure, medium viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminati.. |
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| Pot Life | 120 min | 120 min | |
| Tra-Con Tra-Bond FS302 Easy-Flow No-Sag Epoxy Adhesive TRA-BOND FS-302 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are criti.. |
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| Pot Life | 120 min | 120 min | |
| Tra-Con Tra-Bond FS420 Flexible Plastic Adhesive TRA-BOND FS-420 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermopl.. |
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| Pot Life | 120 min | 120 min | |
| Tra-Con Tra-Cast F311 Optically Transparent Semi-Flexible Casting System TRA-CAST F311 is a clear, low viscosity epoxy formulation developed for molding, embedding, casting and potting applications where clarity, toughness, long pot-life and superior impact properties ar.. |
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| Pot Life | 120 min @Temperature 25.0 °C |
120 min @Temperature 77.0 °F |
100 grams |
| Trelleborg Emerson & Cuming Eccobond® 15 LV Clear Variable Hardness Low Viscosity Catalyst Emerson & Cuming 15 LV Clear Eccobond® Variable Hardness Low Viscosity CatalystLow viscosity. Easy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener .. |
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| Pot Life | 120 min @Temperature 25.0 °C |
120 min @Temperature 77.0 °F |
100 grams |
| Trelleborg Emerson & Cuming Eccobond® 15 LV Variable Hardness Low Viscosity Catalyst Emerson & Cuming 15 LV Eccobond® Variable Hardness Low Viscosity CatalystLow viscosity. Easy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener used. .. |
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| Pot Life | 120 min @Temperature 25.0 °C |
120 min @Temperature 77.0 °F |
100 grams |
| Trelleborg Emerson & Cuming Eccobond® 15 Clear Variable Hardness Catalyst Emerson & Cuming 15 Clear Eccobond® Variable Hardness CatalystEasy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener used. Long working life. Yields .. |
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| Pot Life | 120 min | 120 min | |
| Loctite® Durabond® E-120HP Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli.. |
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| Pot Life | 120 - 180 min @Temperature 23.9 °C |
120 - 180 min @Temperature 75.0 °F |
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| Devcon Tile Adhesive Epoxy Abrasion-Resistant SystemComments: PuttyData provided by Ellsworth Adhesives. |
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| Pot Life | 120 min @Temperature 23.9 °C |
120 min @Temperature 75.0 °F |
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| Devcon Wear Guard (High Temp) Epoxy Abrasion-Resistant SystemComments: PuttyData provided by Ellsworth Adhesives. |
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| Pot Life | 120 min | 120 min | |
| Epoxy Technology EPO-TEK® OE138 Two Component Epoxy Material Description: A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in.. |
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| Pot Life | 120 min | 120 min | |
| Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de.. |
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| Pot Life | 120 - 180 min @Temperature 25.0 °C |
120 - 180 min @Temperature 77.0 °F |
100 g |
| Armstrong C-1/E Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor.. |
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| Pot Life | 120 - 180 min @Temperature 24.0 °C |
120 - 180 min @Temperature 75.2 °F |
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| BCC Products BC 7020 Epoxy Backfill System BC 7020 is a lightweight two component epoxy backfill system. Unlike BC 7010, the filler portion is pre-blended into the resin and hardener components for easier handling, thus simplifying the mixin.. |
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| Pot Life | 120 min @Temperature 25.0 °C |
120 min @Temperature 77.0 °F |
100 gm mass |
| Aremco Aremco-Bond™ 2315 High Performance Epoxide High Temperature, Low Viscosity, Potting Compound for Electrical Applications. |
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| Pot Life | >= 120 min | >= 120 min | |
| Abatron 8311-8A/82033B Filled Potting Compound
(discontinued **) Gray and colors casting, potting, embedding, and adhesive epoxy system. 40% filled. 100/8 ratio.Information provided by Abatron. |
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| Pot Life | >= 120 min | >= 120 min | Mass: 50g; TM R050-19 |
| Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad.. |
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