Polymer Property : Pot Life = 2160 min Product List

Processing Properties

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Processing Properties	Metric	English
Pot Life	2160 min @Temperature 25.0 Â°C	2160 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is..
Pot Life	2160 min @Temperature 25.0 Â°C	2160 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ ME-455-1 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455-1 encapsulant is a low viscosity, one-component, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavi..
Pot Life	2160 min @Temperature 25.0 Â°C	2160 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ ME-525 Underfill Encapsulant LORD Thermosetâ„¢ ME-525 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and wit..
Pot Life	2160 min @Temperature 25.0 Â°C	2160 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch..
Pot Life	2160 min @Temperature 25.0 Â°C	2160 min @Temperature 77.0 Â°F
Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a ..
Pot Life	2160 min	2160 min
Epoxy Technology EPO-TEK® H20F Electrically Conductive, Flexible Epoxy Product Description: EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large di..
Pot Life	2160 min	2160 min
Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditi..