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Epoxy Technology EPO-TEK® H20F Electrically Conductive, Flexible Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H20F Electrically Conductive, Flexible Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach or substrate attach.Advantages & Application Notes: Flexible alternative to EPO-TEK® H20E, designed to offer lower stress, less cracking, and more flexibility. Rheology provides a very soft, smooth, thixotropic paste. No solvents are present.A film suitable for Kapton or Mylar can be flexed 180 degrees and creased without de-lamination or loss of conductivity; can be used instead of conductive silicone RTVs.Can be applied by screen printing, stamping, roller coating techniques; or hand applied. Recommended for fiber-optic packaging. Also suggested for bonding SAW devices, as a low stress adhesive.Applications or end-use could be speaker or microphone circuit related.Hybrid level die attach epoxy capable of resisting wire bonding operations. Also, lid sealing operations will not affect bonded chips in the package.Suggested as a low stress conductive adhesive for large die sizes, as well as oversized components or substrates.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 2.51 g/cc
2.51 g/cc
Part A
3.56 g/cc
3.56 g/cc
Part B
Particle Size <= 45 µm
<= 45 µm
Viscosity 1500 - 3000 cP

@Temperature 23.0 °C
1500 - 3000 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 46
46
Tensile Modulus 0.14584 GPa
21.153 ksi
Storage
Shear Strength >= 4.69 MPa
>= 680 psi
Die
Thermal Properties Metric English Comments
CTE, linear 10.0 µm/m-°C
5.56 µin/in-°F
Below Tg
Thermal Conductivity 4.10 W/m-K
28.5 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 175 °C
347 °F
Continuous
275 °C
527 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 20.0 °C
>= 68.0 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 384 °C
723 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00010 ohm-cm
<= 0.00010 ohm-cm
Processing Properties Metric English Comments
Cure Time 10.0 min

@Temperature 150 °C
0.167 hour

@Temperature 302 °F
Minimum Bond Line
20.0 min

@Temperature 120 °C
0.333 hour

@Temperature 248 °F
Minimum Bond Line
Pot Life 2160 min
2160 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Part A
Silver
Part B
Consistency Smooth thixotropic paste
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 4
Weight Loss 0.51%
200°C
0.78%
250°C
1.79%
300°C
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