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Polymer Property : Cure Time = 1.50 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 90.0 min @Temperature 150 °C |
1.50 hour @Temperature 302 °F |
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| Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch.. |
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| Cure Time | 90.0 min @Temperature 177 °C |
1.50 hour @Temperature 351 °F |
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| Henkel Hysol EA 9695 Film Adhesive Second generation, low flow, composite bonding film; excellent environmental resistance. Composite structure repair, cure and co-cure with composite laminates. Qualified to Airbus. Data from .050 ps.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol EA 9695 Film Adhesive Second generation, low flow, composite bonding film; excellent environmental resistance. Composite structure repair, cure and co-cure with composite laminates. Qualified to Airbus. Data from .050 ps.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol MA 562S Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Nonmetallic, medium tack, excellent slump resistance. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
|
| Henkel Hysol PL 777-1FR Film Adhesive Flame retardant, nonmetallic modified epoxy film adhesiveApplications: Metal and Honeycomb Bonding |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol PL 795SF Composite Surfacing Film Modified epoxy film specifically formulated to improve the surface appearance of composite honeycomb structures. Excellent surface appearance; reduced pinholing, extra finishing. Superior out-time. .. |
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| Cure Time | 90.0 - 120 min @Temperature 149 °C |
1.50 - 2.00 hour @Temperature 300 °F |
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| Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr.. |
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| Cure Time | 90.0 min @Temperature 95.0 °C |
1.50 hour @Temperature 203 °F |
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| Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se.. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
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| Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part f.. |
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| Cure Time | 90.0 min @Temperature 100 °C |
1.50 hour @Temperature 212 °F |
|
| Tra-Con Tra-Bond 293-21 General Purpose Epoxy Adhesive TRA-BOND 293-21 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293 s.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC 890 Course Grade Sliding Wear Compound An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at the thickness of 6 mm (1/4”).. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC 897 Fine Grade Sliding Wear Compound Description: ARC 897 is an advanced ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a t.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC BX2 Contractor Grade Fine Sliding Wear Compound Description: ARC BX2 is an advanced contractor grade ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It .. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC I BX1 Impact & Wear Resistant Epoxy Composite Description: An advanced grade epoxy and urethane composite for the repair and protection of all metal surfaces subjected to severe abrasion and impact. It is normally applied at a thickness of 6 mm.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Foot Traffic |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Light Load |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC MX2 High Wear Fine Particle Wear Compound Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”.. |
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| Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
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| Cure Time | 90.0 min @Temperature 25.0 °C |
1.50 hour @Temperature 77.0 °F |
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| ACC QGel 301 QSI Quantum Silicones High Strength Gel QGel 301 is a clear, very soft, tough, moderately cross-linked, silicone polymer. Silicone gels are used to provide protection from vibration, thermal or mechanical shock. Silicone gels also provide.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Light Load |
| Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
|
| Henkel Hysol EA 9820 Paste Adhesive System High-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting a.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol EA 9825 Paste Adhesive System Low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting an.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol MA 562SFR Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Flame-retardant, nonmetallic, medium tack, excellent slump resistance. |
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