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Polymer Property : Cure Time = 1.50 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 90.0 min @Temperature 82.2 °C |
1.50 hour @Temperature 180 °F |
De-mold Time |
| Northstar Polymers MSN-V40A Polyester Base Low-Rebound Impact/Vibration Dampening Gel This polyurethane casting material is developed for applications that require Shore OO 40 range casting material with vibration dampening property and higher strength than standard polyurethane gel .. |
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| Cure Time | 90.0 min @Temperature 182 °C |
1.50 hour @Temperature 360 °F |
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| Parker Chomerics CHO-FLEX 601 Conductive Coating CHO-FLEX™ 601 coating is specifically designed for EMI shielding of copper/Kapton flexible circuit laminates and for printing circuits on Kapton film. Upon cure, this coating exhibits excellent adh.. |
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| Cure Time | 90.0 min @Temperature 150 °C |
1.50 hour @Temperature 302 °F |
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| Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi.. |
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| Cure Time | 90.0 min @Temperature 150 °C |
1.50 hour @Temperature 302 °F |
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| Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol PL 777-1FR Film Adhesive Flame retardant, nonmetallic modified epoxy film adhesiveApplications: Metal and Honeycomb Bonding |
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| Cure Time | 90.0 - 120 min @Temperature 121 °C |
1.50 - 2.00 hour @Temperature 250 °F |
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| Henkel Hysol PL 7000 Film Adhesive Epoxy film adhesive formulated to provide excellent performance properties in composite bonding, and has excellent results on composite surfaces that have been exposed to bond shop environments and .. |
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| Cure Time | 90.0 - 120 min @Temperature 149 °C |
1.50 - 2.00 hour @Temperature 300 °F |
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| Master Bond EP17HT One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT is an one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation prof.. |
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| Cure Time | 90.0 - 120 min @Temperature 149 °C |
1.50 - 2.00 hour @Temperature 300 °F |
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| Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr.. |
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| Cure Time | 90.0 min @Temperature 95.0 °C |
1.50 hour @Temperature 203 °F |
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| Tra-Con Tra-Bond 293-1.5T General Purpose Instrument Epoxy Adhesive-Flexible TRA-BOND 293-1.5T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This v.. |
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| Cure Time | 90.0 min @Temperature 95.0 °C |
1.50 hour @Temperature 203 °F |
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| Tra-Con Tra-Bond 293-1T General Purpose Instrument Epoxy Adhesive-Thixotropic TRA-BOND 293-1T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This ver.. |
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| Cure Time | 90.0 min @Temperature 100 °C |
1.50 hour @Temperature 212 °F |
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| Tra-Con Tra-Bond 293-21 General Purpose Epoxy Adhesive TRA-BOND 293-21 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293 s.. |
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| Cure Time | 90.0 min @Temperature 100 °C |
1.50 hour @Temperature 212 °F |
|
| Trelleborg Emerson & Cuming Eccobond® A 359 One-Component High Temperature Performance Epoxy Adhesive Emerson & Cuming A 359 Eccobond® One-Component High Temperature Performance Epoxy AdhesiveAluminum filled, heat curing, epoxy adhesive. Sag resistant. Exceptional thermal and chemical resistance. H.. |
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| Cure Time | 90.0 min @Temperature 125 °C |
1.50 hour @Temperature 257 °F |
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| Trelleborg Emerson & Cuming Eccobond® C429-2 One-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming C429-2 Eccobond® One-Component Silver Filled Electrically Conductive Epoxy AdhesiveOne component, high strength, moderate cost, silver filled, electrically conductive, epoxy adhesi.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC 890 Course Grade Sliding Wear Compound An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at the thickness of 6 mm (1/4”).. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC BX1 Sliding Wear Compound Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at.. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos.. |
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| Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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| Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H.. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H70E-1 Thermally Conductive, Electrically Insulating Epoxy Material Description: A two component, thermally conductive, electrically insulating epoxy adhesive designed for semiconductor and microelectronic packaging. It is most commonly used for die-attach.. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H70E-2LC Thermally Conductive, Electrically Insulating Epoxy Material Description: A two component, thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips .. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
Minimum |
| Epoxy Technology EPO-TEK® TV2001 Thermally Conductive, Electrically Insulating Epoxy Material Description: A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate potlife, snap-curing and.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC MX2 High Wear Fine Particle Wear Compound Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”.. |
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| Cure Time | 90.0 min @Temperature 25.0 °C |
1.50 hour @Temperature 77.0 °F |
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| ACC QGel 301 QSI Quantum Silicones High Strength Gel QGel 301 is a clear, very soft, tough, moderately cross-linked, silicone polymer. Silicone gels are used to provide protection from vibration, thermal or mechanical shock. Silicone gels also provide.. |
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| Cure Time | 90.0 min @Temperature 25.0 °C |
1.50 hour @Temperature 77.0 °F |
|
| ACC QGel 311 QSI Quantum Silicones General Purpose Silicone Gel QGel 311 is a clear, fast cure, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid.. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
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| Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro.. |
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| Cure Time | 90.0 min @Temperature 180 °C |
1.50 hour @Temperature 356 °F |
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| Atom Adhesives AA-DUCT AD1 Epoxy Adhesive AA-DUCT AD1 is a single component epoxy, formulated with pure silver power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive .. |
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| Cure Time | 90.0 min @Temperature 180 °C |
1.50 hour @Temperature 356 °F |
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| Atom Adhesives AA-DUCT CG2 Epoxy Adhesive AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulati.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Light Load |
| Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton MRS 58 Metal Rebuilding System An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 1.5 mm (60 mils) or mo.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol PL 460 Core Splice Adhesive Foaming epoxy adhesive in paste form for easy extrusion through packaged cartridges. Expands and cures at temperatures from 250°F / 121°C to 350°F / 177°C. Qualified to Boeing BMS 5-90, Type IV... |
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