- HOME
- POLYMER SEARCH
- Polymer Property : Cure Time = 2.00 hour
Polymer Property : Cure Time = 2.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 - 120 min @Temperature 177 °C |
1.00 - 2.00 hour @Temperature 351 °F |
|
| Henkel Hysol PL 7000 Film Adhesive Epoxy film adhesive formulated to provide excellent performance properties in composite bonding, and has excellent results on composite surfaces that have been exposed to bond shop environments and .. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 - 98.9 °C |
1.00 - 2.00 hour @Temperature 200 - 210 °F |
first |
| Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offer.. |
|||
| Cure Time | 90.0 - 120 min @Temperature 149 °C |
1.50 - 2.00 hour @Temperature 300 °F |
|
| Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 23.9 °C |
1.00 - 2.00 hour @Temperature 75.0 °F |
|
| Master Bond EP21TDCF-3 Two Component, Higher Viscosity Epoxy System Product Description: Master Bond EP21TDCF-3 is a two component epoxy for high performance bonding and sealing. It is formulated to cure rapidly at room temperature or faster at elevated temperatures.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDCS Silver Filled Electrically Conductive Epoxy Compound Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDCSMed Two Component, Silver Conductive USP Class VI Epoxy Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. The high strength.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP33CLV Epoxy Resists Chemicals and High Temperatures Description: Master Bond EP33CLV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and excel.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP76M-F Electrically Conductive, Two Part Epoxy Description: Master Bond EP76M-F is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing, and coating formulated to cure at room temperature or .. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond MasterSil 151Med Medical Grade Silicone Potting Compound Description: Master Bond MasterSil 151Med is a two component, low viscosity silicone compound for high performance potting and encapsulation. MasterSil 151Med is an addition cured system and does no.. |
|||
| Cure Time | 60.0 - 120 min @Temperature >=79.4 °C |
1.00 - 2.00 hour @Temperature >=175 °F |
|
| Master Bond MB600SCN Aqueous Based Electrically Conductive Sodium Silicate Coating Master Bond MB600SCN is an aqueous based, sodium silicate system with a silver coated nickel filler. It is intended for use in applications where very good shielding effectiveness is required and co.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond SteelMaster 43HT Stainless Steel Filled Two Component Epoxy System Master Bond Steelmaster 43HT is a high performance, stainless steel filled two component epoxy resin system for the cost effective repair, maintenance, rebuilding, restoring and resealing of worn or.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond Supreme 11ANHT Fast Curing Epoxy Paste System Description: Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevat.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 125 °C |
1.00 - 2.00 hour @Temperature 257 °F |
|
| Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond F110 Optically Transparent Low Viscosity Epoxy Adhesive TRA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. This room temperature curing system is an excellent choice for thin bond-line assembly and repair applications of prisms.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 1309 General Purpose Catalyst Emerson & Cuming 1309 Eccobond® General Purpose CatalystFaster curing version of 9. Very fast room temperature curing, low viscosity, general purpose. Short working life. Imparts excellent chemical.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 9 General Purpose Catalyst Emerson & Cuming 9 Eccobond® General Purpose CatalystGeneral purpose, low viscosity. Imparts good physical strength and chemical resistance to cured castings. Recommended for most general purpose a.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP30-2 Low Outgassing, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly a.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP35 High Temperature Resistant Two Component Epoxy System Master Bond Polymer Adhesive EP35 is a unique, room temperature curing, two component epoxy adhesive for high temperature bonding applications. Master Bond Polymer Adhesive EP35 produces high stren.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond Supreme 11HT-LO Adhesive and Sealant Serviceable to +400°F Description: Master Bond Polymer System Supreme 11HT-LO is an easy to use two part epoxy adhesive/sealant combining both high shear and high peel strengths along with a relatively fast cure at room .. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.0 - 105 °C |
1.00 - 2.00 hour @Temperature 199 - 221 °F |
|
| Abatron ROCKWELD 55-27 A/B Structural Adhesive Putty; Epoxy ROCKWELD 55-27 is a 2-component epoxy system with low density, high-strength, and no shrinkage. It is a structural adhesive putty for sculpturing, repairs and restoration of stone, concrete and maso.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
|
| Atom Adhesives AA-BOND F113 Epoxy Adhesive AA-BOND F113 is an Optically Clear, low viscosity , High impact epoxy adhesives developed for bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays, an.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 150 - 160 °C |
1.00 - 2.00 hour @Temperature 302 - 320 °F |
|
| Abatron AboCast 8501-6 One-Component Epoxy AboCast 8501-6 is a clear, high-temperature one-component epoxy system for very high-temperature uses. It offers the highest heat resistance of the clear resins. Suggested Uses: Casting; Potting; E.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 180 °C |
1.00 - 2.00 hour @Temperature 356 °F |
|
| Abatron AboCast 8708-6 One-Component Structural/Dielectric Epoxy AboCast 8708-6 is a highly filled, class H (180°C) structural, castable adhesive compound for SLOW high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Emb.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP21TP-2 Oil And Fuel Resistant Polysulfide Based Adhesive System Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 1 to 1 mix r.. |
|||
| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP33LV Epoxy Has Dimensional Stability and Machinability Description: Master Bond EP33LV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g.. |
|||
Copyright © lookpolymers.com All Rights Reserved