Polymer Property : Cure Time = 3600 min Product List

Processing Properties

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Processing Properties	Metric	English
Cure Time	2880 - 3600 min @Temperature 23.0 °C	48.0 - 60.0 hour @Temperature 73.4 °F
Master Bond EP21TPND Non Drip Polysulfide Based Two Component Adhesive System Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 m..
Cure Time	2880 - 3600 min @Temperature 23.0 °C	48.0 - 60.0 hour @Temperature 73.4 °F
Master Bond EP21BAS Radiopaque Two Component Epoxy Master Bond Polymer System EP21BAS is a radiopaque epoxy compound which offers outstanding performance and superior processability. Radiopaque epoxy polymer compounds are employed for medical diagno..
Cure Time	1800 - 3600 min @Temperature 121 °C	30.0 - 60.0 hour @Temperature 250 °F
Master Bond EP40 High Shear and Peel Strength, Two Component, Flexible Epoxy Master Bond Polymer System EP40 is newly developed two component highly flexible epoxy compound for high performance bonding, potting, encapsulation, and sealing with outstanding shear and peel stre..
Cure Time	2880 - 3600 min @Temperature 23.0 °C	48.0 - 60.0 hour @Temperature 73.4 °F
Master Bond EP21TP-2 Oil And Fuel Resistant Polysulfide Based Adhesive System Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 1 to 1 mix r..