Polymer Property : Gel Time = 5.00 min Product List

Processing Properties

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Processing Properties	Metric	English
Gel Time	3.00 - 5.00 min	3.00 - 5.00 min
Resin Technology Group 1121 Two component Polyurethane Adhesive Resin Technology Group 1121 Two component Polyurethane AdhesiveMedium viscosity, clear, Lexan bonding adhesive
Gel Time	3.00 - 5.00 min @Temperature 150 Â°C	3.00 - 5.00 min @Temperature 302 Â°F
Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is..