Processing Properties | Metric | English | Comments |
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Gel Time | 6.00 min | 6.00 min | |
Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 3K PW Carbon Reinforced Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle.. |
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Gel Time | 6.00 min @Temperature 150 °C |
6.00 min @Temperature 302 °F |
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Lord Adhesives Thermosetâ„¢ ME-531 Underfill Encapsulant LORD Thermosetâ„¢ ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and wit.. |
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Gel Time | 6.00 - 10.0 min | 6.00 - 10.0 min | MA130LFE |
C.O.I.M. FILCO® 358 Film Former for Glass Fiber Sizes Description: Film Former for Glass Fiber SizesGeneral Information: COIM has developed a range of polyesters for the treatment of glass fiber. These polyesters come in powder and emulsion form and ar.. |
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Gel Time | 6.00 min @Temperature 93.0 °C |
6.00 min @Temperature 199 °F |
10 g |
Abatron AboCast 8110-6/AboCure 8110-1 Flexible Epoxy This epoxy system can achieve flexibility and plasticity without sacrificing adhesive, electrical, structural, and other properties. This compound is a clear (unfilled) basic formulation. Its applic.. |