Polymer Property : Volume Resistivity = 0.0070 ohm-cm Product List

Electrical Properties

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Electrical Properties	Metric	English	Comments
Volume Resistivity	0.0070 ohm-cm	0.0070 ohm-cm	as supplied without pressure sensitive adhesive; MIL-DLT-83528
Parker Chomerics CHO-SEAL 1239 Conductive Elastomer Material for waveguide choke, cover, and flange EMI shielding and pressure sealing; maximum heat transfer and minimum outgassing; hard (80 Shore A), high-strength material; available with raised lip..
Volume Resistivity	<= 0.0070 ohm-cm	<= 0.0070 ohm-cm	QA-1039
Parker Chomerics Waveguide Gaskets 877 Conductive Silicone Elastomer Gasket Description: TECKNIT® WAVEGUIDE GASKETS are made from a silicone elastomer filled with silver-plated particles designed to achieve maximum electrical conductivity.Application Information: TECKNIT W..
Volume Resistivity	0.0070 ohm-cm	0.0070 ohm-cm
Parker Chomerics Tecknit Teckfip™ FIP-E Formed in Place Conductive Elastomer Commercial grade FIP compound designed for moderate shielding performance. The Ag/glass particles are very smooth which leads to very low compression set value. The material is also available as a h..
Volume Resistivity	0.0070 ohm-cm	0.0070 ohm-cm	95-40-5555
Parker Chomerics CHO-BOND 2165 Polyurethane Sealant Conductive sealant is a stabilized copper filled, two component polyurethane. It has excellent electrical and physical properties for aerospace and military applications. CHO-BOND® 2165 sealant is ..
Volume Resistivity	0.0070 ohm-cm	0.0070 ohm-cm	cured 2 hrs @ 65°C
Tra-Con Tra-Duct 2916T Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2916T is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good el..
Volume Resistivity	0.0070 ohm-cm	0.0070 ohm-cm	cured 15 min @ 100°C
Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunicatio..